PD IEC/TR 62258-8:2008
Current
The latest, up-to-date edition.
Semiconductor die products EXPRESS model schema for data exchange
Hardcopy , PDF
English
30-09-2008
Important note : Users cannot be edited or removed once added to your Multi user PDF.
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Data exchange
Annex A (normative) - EXPRESS model schema
Annex B (informative) - STEP physical file example
Assists the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, - minimally or partially encapsulated die and wafers.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 06/30127629 DC. (10/2008)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
IEC/TR 62258-8:2008(E), which is a technical report, has been developed to facilitate the production, supply and use of semiconductor die products, including wafers; singulated bare die; die and wafers with attached connection structures; minimally or partially encapsulated die and wafers. This Technical Report contains an EXPRESS model schema that describes the elements needed for data exchange and that will allow the implementation of the requirements of the IEC 62258-1, IEC 62258-5 and IEC 62258-6 standards, as well as providing an exchange structure that is complementary to those defined in IEC 62258-2. It is also complementary to and compatible with the questionnaire in IEC 62258-4.
| Standards | Relationship |
| IEC TR 62258-8:2008 | Identical |
| CLC/TR 62258-8:2008 | Identical |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| IEC 62258-5:2006 | Semiconductor die products - Part 5: Requirements for information concerning electrical simulation |
| ISO 10303-11:2004 | Industrial automation systems and integration Product data representation and exchange Part 11: Description methods: The EXPRESS language reference manual |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| ISO 10303-21:2002 | Industrial automation systems and integration Product data representation and exchange Part 21: Implementation methods: Clear text encoding of the exchange structure |
| IEC 62258-6:2006 | Semiconductor die products - Part 6: Requirements for information concerning thermal simulation |
| IEC TR 62258-4:2012 | Semiconductor die products - Part 4: Questionnaire for die users and suppliers |
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