PD IEC/TS 62647-22:2013
Current
The latest, up-to-date edition.
Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
Hardcopy , PDF
English
31-10-2013
| Committee |
GEL/107
|
| DocumentType |
Standard
|
| Pages |
74
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
This part of IEC 62647 is intended for use as technical guidance by aerospace, defence, and high performance (ADHP) electronic applications and systems suppliers, e.g., original equipment manufacturers (OEMs) and system maintenance facilities, in developing and implementing designs and processes to ensure the continued performance, quality, reliability, safety, airworthiness, configuration control, affordability, maintainability, and supportability of high performance aerospace systems (subsequently referred to as ADHP) both during and after the transition to Pb-free electronics.
The guidelines may be used by the OEMs and maintenance facilities to implement the methodologies they use to ensure the performance, reliability, airworthiness, safety, and certifiability of their products, in accordance with IEC/TS 62647-1:2012.
This document also contains lessons learned from previous experience with Pb-free aerospace electronic systems. The lessons learned give specific references to solder alloys and other materials, and their expected applicability to various operating environmental conditions. The lessons learned are intended for guidance only; they are not guarantees of success in any given application.
This document may be used by other high-performance and high-reliability industries, at their discretion.
| Standards | Relationship |
| IEC TS 62647-22:2013 | Identical |
| IEC PAS 62647-3:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes |
| MIL-I-46058 Revision C:1972 | Insulating Compound, Electrical (for Coating Printed Circuit Assemblies) |
| ASTM G 85 : 2011 : REDLINE | Standard Practice for Modified Salt Spray (Fog) Testing |
| IEC TS 62647-21:2013 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics |
| GEIA HB 0005-3 : 2008 | REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| IEC PAS 62647-23:2011 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
| IEC TS 62647-1:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan |
| GEIA STD 0006 : 2008 | REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS |
| ARINC 671 : 2006 | GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR |
| IEC TS 62647-2:2012 | Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin |
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