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SEMI 3D3:2013

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

GUIDE FOR MULTIWAFER TRANSPORT AND STORAGE CONTAINERS FOR 300 MM, THIN SILICON WAFERS ON TAPE FRAMES

Superseded date

16-11-2023

Superseded by

SEMI 3D3:2013(R2018)

Published date

28-07-2013

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Gives the user with information about containers needed to ship thin wafers that are mounted on dicing tape to tape frames conforming to either SEMI G74 or SEMI G87.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (07/2013)
DocumentType
Revision
ProductNote
PRICE HAS BEEN UPDATED
PublisherName
Semiconductor Equipment & Materials Institute
Status
Superseded
SupersededBy

SEMI G74 : 1999(R2015) SPECIFICATION FOR TAPE FRAME FOR 300 MM WAFERS
SEMI M31 : 2008 MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
SEMI G87 : 2008(R2015) SPECIFICATION FOR PLASTIC TAPE FRAME FOR 300 MM WAFER
SEMI G94:2013 SPECIFICATION FOR COIN-STACK TYPE TAPE FRAME SHIPPING CONTAINER FOR 300 MM WAFER

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