SEMI E21.1 : 2015
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR CLUSTER TOOL MODULE INTERFACE 300 MM: MECHANICAL INTERFACE AND WAFER TRANSPORT
Published date
12-01-2013
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Specifies the range of SEMI E21 to include 300 mm diameter wafers. Also provides 300 mm compatible values for all the parameters defined in SEMI E21.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. Not available separately, Published within the SEMI E21 family of standards. (02/2009)
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| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI E106 : 2004 | OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS |
| SEMI T20.3 : 2010(R2016) | SPECIFICATION FOR SERVICE COMMUNICATION FOR AUTHENTICATION OF SEMICONDUCTORS AND RELATED PRODUCTS |
| SEMI E166 : 2014 | SPECIFICATION FOR 450 MM CLUSTER MODULE INTERFACE: MECHANICAL INTERFACE AND TRANSPORT STANDARD |
| SEMI E21 : 2015 | SPECIFICATION FOR CLUSTER TOOL MODULE INTERFACE: MECHANICAL INTERFACE AND WAFER TRANSPORT |
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