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SEMI E21.1 : 2015

SEMI E21.1 : 2015

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR CLUSTER TOOL MODULE INTERFACE 300 MM: MECHANICAL INTERFACE AND WAFER TRANSPORT

Published date

12-01-2013

Publisher

Semiconductor Equipment & Materials Institute

Specifies the range of SEMI E21 to include 300 mm diameter wafers. Also provides 300 mm compatible values for all the parameters defined in SEMI E21.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. Not available separately, Published within the SEMI E21 family of standards. (02/2009)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI E106 : 2004 OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS
SEMI T20.3 : 2010(R2016) SPECIFICATION FOR SERVICE COMMUNICATION FOR AUTHENTICATION OF SEMICONDUCTORS AND RELATED PRODUCTS
SEMI E166 : 2014 SPECIFICATION FOR 450 MM CLUSTER MODULE INTERFACE: MECHANICAL INTERFACE AND TRANSPORT STANDARD

SEMI E21 : 2015 SPECIFICATION FOR CLUSTER TOOL MODULE INTERFACE: MECHANICAL INTERFACE AND WAFER TRANSPORT

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