SEMI E72 : 2016
Current
Current
The latest, up-to-date edition.
SPECIFICATION AND GUIDE FOR 300 MM EQUIPMENT FOOTPRINT, HEIGHT, AND WEIGHT
Published date
12-01-2013
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Defines limits on the footprint, height, and weight of production equipment for wafers of 300 mm or greater diameter.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001)
|
| DocumentType |
Standard
|
| PublisherName |
Semiconductor Equipment & Materials Institute
|
| Status |
Current
|
| SEMI E106 : 2004 | OVERVIEW GUIDE TO SEMI STANDARDS FOR PHYSICAL INTERFACES AND CARRIERS FOR 300 MM WAFERS |
| SEMI E149 : 2014 | GUIDE FOR EQUIPMENT SUPPLIER-PROVIDED DOCUMENTATION FOR THE ACQUISITION AND USE OF MANUFACTURING EQUIPMENT |
| SEMI F107 : 2009 | GUIDE FOR PROCESS EQUIPMENT ADAPTER PLATES |
| SEMI E117 : 2017 | SPECIFICATION FOR RETICLE LOAD PORT |
| SEMI E6 : 2014 | GUIDE FOR SEMICONDUCTOR EQUIPMENT INSTALLATION DOCUMENTATION |
| SEMI E154 : 2014 | MECHANICAL INTERFACE SPECIFICATION FOR 450 MM LOAD PORT |
| SEMI E15-1 : 2005(R2010) | SPECIFICATION FOR 300 MM TOOL LOAD PORT |
| SEMI E140 : 2012 | GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR GAS DELIVERY SYSTEMS |
| SEMI E35 : 2012 | GUIDE TO CALCULATE COST OF OWNERSHIP (COO) METRICS FOR SEMICONDUCTOR MANUFACTURING EQUIPMENT |
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