SEMI M74 : 2008(R2018)
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR 450 MM DIAMETER MECHANICAL HANDLING POLISHED WAFERS
Published date
08-11-2018
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Specifies 450 mm diameter mechanical handling wafers intended for use in research, development and early design investigation of 450 mm semiconductor equipment such as 450 mm wafers, carriers, load ports, AMHS, and robotics.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. Also available in CD-ROM. (10/2008)
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| DocumentType |
Revision
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
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| SEMI M76 : 2010 | SPECIFICATION FOR DEVELOPMENTAL 450 MM DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS |
| SEMI M80 : 2016 | SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 450 MM WAFERS |
| SEMI E159 : 2014 | MECHANICAL SPECIFICATION FOR MULTI APPLICATION CARRIER (MAC) USED TO TRANSPORT AND SHIP 450 MM WAFERS |
| SEMI E158 : 2014 | MECHANICAL SPECIFICATION FOR FAB WAFER CARRIER USED TO TRANSPORT AND STORE 450 MM WAFERS (450 FOUP) AND KINEMATIC COUPLING |
| SEMI MF533 : 2010(R2016) | TEST METHODS FOR THICKNESS AND THICKNESS VARIATION OF SILICON WAFERS |
| SEMI M59 : 2014 | TERMINOLOGY FOR SILICON TECHNOLOGY |
| SEMI MF928 : 2017 | TEST METHOD FOR EDGE CONTOUR OF CIRCULAR SEMICONDUCTOR WAFERS AND RIGID DISK SUBSTRATES |
| SEMI MF1530 : 2007(R2018) | TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
| SEMI M20 : 2015 | PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM |
| SEMI MF1451:2007(R2019) | TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING |
| SEMI T3 : 2013 | SPECIFICATION FOR WAFER BOX LABELS |
| SEMI MF1152 : 2016 | TEST METHOD FOR DIMENSIONS OF NOTCHES ON SILICON WAFERS |
| SEMI T7 : 2016 | SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL |
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