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SEMI T3 : 2013

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR WAFER BOX LABELS

Published date

12-01-2013

Specifies a common format, content, size, and location for printed, machine-readable labels on wafer boxes to facilitate communication of data essential for advanced traceability and electronic data exchange systems.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. (05/2001)
DocumentType
Standard
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI M8 : 2012 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON TEST WAFERS
SEMI M38 : 2012(R2018) SPECIFICATION FOR POLISHED RECLAIMED SILICON WAFERS
SEMI M45 : 2010(R2017) SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM
SEMI M76 : 2010 SPECIFICATION FOR DEVELOPMENTAL 450 MM DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI M24 : 2007 SPECIFICATION FOR POLISHED MONOCRYSTALLINE SILICON PREMIUM WAFERS
SEMI M1 : 2017 SPECIFICATION FOR POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI M74 : 2008(R2018) SPECIFICATION FOR 450 MM DIAMETER MECHANICAL HANDLING POLISHED WAFERS
SEMI M84 : 2014E SPECIFICATIONS FOR POLISHED SINGLE CRYSTAL SILICON WAFERS FOR GALLIUM NITRIDE-ON-SILICON APPLICATIONS
SEMI M62 : 2017 SPECIFICATIONS FOR SILICON EPITAXIAL WAFERS
SEMI T20.1 : 2009(R2016) SPECIFICATION FOR OBJECT LABELING TO AUTHENTICATE SEMICONDUCTORS AND RELATED PRODUCTS IN AN OPEN MARKET
SEMI M57 : 2016 SPECIFICATION FOR SILICON ANNEALED WAFERS

SEMI M45 : 2010(R2017) SPECIFICATION FOR 300 MM WAFER SHIPPING SYSTEM
SEMI M31 : 2008 MECHANICAL SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 300 MM WAFERS
SEMI T7 : 2016 SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL

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