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SEMI M74 : 2008(R2018)

SEMI M74 : 2008(R2018)

Current

Current

The latest, up-to-date edition.

SPECIFICATION FOR 450 MM DIAMETER MECHANICAL HANDLING POLISHED WAFERS

Published date

08-11-2018

Publisher

Semiconductor Equipment & Materials Institute

Specifies 450 mm diameter mechanical handling wafers intended for use in research, development and early design investigation of 450 mm semiconductor equipment such as 450 mm wafers, carriers, load ports, AMHS, and robotics.

DevelopmentNote
Not available for sale from ILI, customer to contact SEMI. Also available in CD-ROM. (10/2008)
DocumentType
Revision
PublisherName
Semiconductor Equipment & Materials Institute
Status
Current

SEMI M76 : 2010 SPECIFICATION FOR DEVELOPMENTAL 450 MM DIAMETER POLISHED SINGLE CRYSTAL SILICON WAFERS
SEMI M80 : 2016 SPECIFICATION FOR FRONT-OPENING SHIPPING BOX USED TO TRANSPORT AND SHIP 450 MM WAFERS
SEMI E159 : 2014 MECHANICAL SPECIFICATION FOR MULTI APPLICATION CARRIER (MAC) USED TO TRANSPORT AND SHIP 450 MM WAFERS
SEMI E158 : 2014 MECHANICAL SPECIFICATION FOR FAB WAFER CARRIER USED TO TRANSPORT AND STORE 450 MM WAFERS (450 FOUP) AND KINEMATIC COUPLING

SEMI MF533 : 2010(R2016) TEST METHODS FOR THICKNESS AND THICKNESS VARIATION OF SILICON WAFERS
SEMI M59 : 2014 TERMINOLOGY FOR SILICON TECHNOLOGY
SEMI MF928 : 2017 TEST METHOD FOR EDGE CONTOUR OF CIRCULAR SEMICONDUCTOR WAFERS AND RIGID DISK SUBSTRATES
SEMI MF1530 : 2007(R2018) TEST METHOD FOR MEASURING FLATNESS, THICKNESS, AND TOTAL THICKNESS VARIATION ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI M20 : 2015 PRACTICE FOR ESTABLISHING A WAFER COORDINATE SYSTEM
SEMI MF1451:2007(R2019) TEST METHOD FOR MEASURING SORI ON SILICON WAFERS BY AUTOMATED NON-CONTACT SCANNING
SEMI T3 : 2013 SPECIFICATION FOR WAFER BOX LABELS
SEMI MF1152 : 2016 TEST METHOD FOR DIMENSIONS OF NOTCHES ON SILICON WAFERS
SEMI T7 : 2016 SPECIFICATION FOR BACK SURFACE MARKING OF DOUBLE-SIDE POLISHED WAFERS WITH A TWO-DIMENSIONAL MATRIX CODE SYMBOL

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