SEMI P1 : 2008E
Current
Current
The latest, up-to-date edition.
SPECIFICATION FOR HARD SURFACE PHOTOMASK SUBSTRATES
Published date
12-01-2013
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Covers the general requirements of glass substrate for hard surface photomasks.
| DevelopmentNote |
Not available for sale from ILI, customer to contact SEMI. (05/2001) Also available in CD-ROM. (06/2008) E = This standard was editorially modified to correct an error. (12/2009)
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| DocumentType |
Standard
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| PublisherName |
Semiconductor Equipment & Materials Institute
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| Status |
Current
|
| SEMI P37 : 2013 | SPECIFICATION FOR EXTREME ULTRAVIOLET LITHOGRAPHY SUBSTRATES AND BLANKS |
| SEMI D26 : 2000 | PROVISIONAL SPECIFICATION FOR LARGE AREA MASKS FOR FLAT PANEL DISPLAYS (NORTH AMERICA) |
| SEMI P29 : 2011 | SPECIFICATION FOR CHARACTERISTICS SPECIFIC TO ATTENUATED PHASE SHIFT MASKS AND MASKS BLANKS |
| SEMI P10 : 2012 | SPECIFICATION OF DATA STRUCTURES FOR PHOTOMASK ORDERS |
| SEMI D6 : 2011(R2017) | SPECIFICATION FOR LIQUID CRYSTAL DISPLAY (LCD) MASK SUBSTRATES |
| SEMI P48 : 2010(R2016) | SPECIFICATION OF FIDUCIAL MARKS FOR EUV MASK BLANK |
| SEMI P2 : 2008 | SPECIFICATION FOR CHROME THIN FILMS FOR HARD SURFACE PHOTOMASKS |
| BS IEC 62899-301-1:2017 | Printed electronics Equipment. Contact printing. Rigid master. Measurement method of plate master external dimension |
| SEMI T11 : 2003(R2014) | SPECIFICATION FOR MARKING OF HARD SURFACE RETICLE SUBSTRATES |
| SEMI P23 : 2000(R2007) | GUIDELINE FOR PROGRAMMED DEFECT MASKS AND BENCHMARK PROCEDURES FOR SENSITIVITY ANALYSIS OF MASK DEFECT INSPECTION SYSTEMS |
| SEMI D38 : 2011 | GUIDE FOR QUALITY AREA OF LCD MASKS |
| SEMI P3 : 2008 | SPECIFICATION FOR PHOTORESIST/E-BEAM RESIST FOR HARD SURFACE PHOTOPLATES |
| IEC 62899-301-1:2017 | Printed electronics - Part 301-1: Equipment - Contact printing - Rigid master - Measurement method of plate master external dimension |
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