SN EN 62258-1 : 2005

INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
   3.1 Basic definitions
   3.2 General terminology
   3.3 Semiconductor manufacturing and
        interconnection terminology
4 General requirements
   4.1 General
   4.2 Identity
   4.3 Source
   4.4 Function
   4.5 Electrical and physical characteristics
   4.6 Geometry
   4.7 Connectivity
   4.8 Documentation
   4.9 Test and quality
   4.10 Handling
   4.11 Assembly
   4.12 Thermal data
   4.13 Models
5 Data exchange
6 Requirements for bare die with and without
   connection structures
   6.1 Form of supply
   6.2 Die name
   6.3 Die version
   6.4 Manufacturer
   6.5 Type number
   6.6 Function
   6.7 Information source
   6.8 Data version
   6.9 Units of measurement
   6.10 Geometric view
   6.11 Die size
   6.12 Die thickness
   6.13 Geometric origin
   6.14 Dimension tolerances
   6.15 Pad count
   6.16 Pad information
   6.17 Signal type
   6.18 Technology
   6.19 Semiconductor material
   6.20 Substrate material
   6.21 Substrate connection
   6.22 Passivation material
   6.23 Pad metallization
   6.24 Backside finish
   6.25 Wafer size
   6.26 Wafer thickness
   6.27 Wafer map
   6.28 Power dissipation
   6.29 Operating temperature
   6.30 Packing
   6.31 Supplier
   6.32 Bump material
   6.33 Bump size
   6.34 Bump height tolerance
   6.35 Connection material
   6.36 Die picture
   6.37 Die fiducials
7 Minimally packaged devices
   7.1 General
   7.2 Terminal position
   7.3 Terminal size
   7.4 Number of terminals
   7.5 Package size
   7.6 Seated height
   7.7 Encapsulation material
   7.8 Terminal material
   7.9 Package style code
8 Test, quality and reliability
   8.1 General
   8.2 Outgoing quality level
   8.3 Electrical parameters specified
   8.4 Compliance to standards
   8.5 Additional device screening
   8.6 Reliability
   8.7 Product status
9 Requirements for handling and shipping
   9.1 General
   9.2 Specific requirements for bare die or
        wafers - Die version
   9.3 Specific requirements for wafers -
        Product grading
   9.4 Special item requirements
10 Requirements for storage
   10.1 General
   10.2 Storage duration and conditions
   10.3 Long-term storage
11 Information related to assembly
   11.1 General
   11.2 Attach methods and materials
   11.3 Bonding method and materials
Annex A (informative) Terminology
   A.1 Assembly terminology
   A.2 Test terminology
   A.3 Semiconductor terminology
   A.4 Semiconductor assembly technology
   A.5 Design and simulation terminology
   A.6 Packing and delivery terminology
   A.7 Handling terminology
Annex B (informative) Acronyms
   B.1 Organizations and standards
   B.2 General terminology
   B.3 Manufacturing and test terminology
   B.4 Semiconductors
   B.5 Design, simulation and data exchange
   B.6 Electronic technology
   B.7 Packaging
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications
Bibliography

Describes the minimum requirements for the data which are needed to describe such die products and is intended as an aid in the design of and procurement of assemblies incorporating die products.