Development Note
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Indice de classement: C96-029U. (02/2012) |
Document Type
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Standard |
ISBN
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Pages
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Published
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Publisher
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Association Francaise de Normalisation
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Status
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Current |
UTEC 96 027 : 2011
|
OBSOLESCENCE ELECTRONIC COMPONENTS - RULES CONCERNING THE TREATMENT OF PRODUCT DISCONTINUANCE AND REPLACEMENT |
UTEC 80 810 : 2005
|
RELIABILITY DATA HANDBOOK - UNIVERSAL MODEL FOR RELIABILITY PREDICTION OF ELECTRONICS COMPONENTS, PCBS AND EQUIPMENT |
IEC 60068-2-20:2008
|
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
NF EN 60068 2-17 : 1995
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ENVIRONMENTAL TESTING - PART 2: TESTS - TEST Q: SEALING |
IEC 61340-5-1:2016
|
Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
IEC TR 61340-5-2:2007
|
Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
IEC TS 61945:2000
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Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis |
NF ISO 2859-1 : 2000 AMD 1 2011
|
SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - PART 1: SAMPLING SCHEMES INDEXED BY ACCEPTANCE QUALITY LIMIT (AQL) FOR LOT-BY-LOT INSPECTION |
EN 190000:1995
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Generic Specification: Monolithic integrated circuits |
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