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  • IEC TR 61340-5-2:2007

    View superseded by
    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  31-12-2021

    Language(s): 

    Published date:  14-08-2007

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions and abbreviated terms
    4 Personnel safety
    5 ESD control program
    6 Automated handling equipment (AHE)
    7 ESD control gloves and finger cots
    8 Handtools
    Annex A (informative) - Example ESD control program plan
            based on IEC 61340-5-1
    Annex B (informative) - ESD control element considerations
    Bibliography

    Abstract - (Show below) - (Hide below)

    This technical report has been developed to support IEC 61340-5-1.The controls and limits referenced in IEC 61340-5-1 were developed to protect devices that are susceptible to discharges of 100 V or greater using the human body model test method. However, the general concepts are still valid for devices that are susceptible to discharges of less than 100 V.The main changes with respect to the previous edition are listed below:This version has been modified to provide guidance for users of IEC 61340-5-1. The text has been arranged to follow the requirements of IEC 61340-5-1 as closely as possible as well as providing specific guidance on each of the requirements of IEC 61340-5-1.The contents of the corrigendum of May 2009 have been included in this copy.

    General Product Information - (Show below) - (Hide below)

    Development Note Supersedes IEC TS 61340-5-2. (08/2007) Stability Date: 2020. (04/2018)
    Document Type Technical Report
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    08/30180398 DC : 0 BS EN 60747-16-5 - SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
    13/30286159 DC : 0 BS EN 62435-1 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    BS EN 60747-16-5:2013 Semiconductor devices Microwave integrated circuits. Oscillators
    13/30286167 DC : 0 BS EN 62435-5 - ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5 - DIE & WAFER DEVICES
    IEC TS 62239-2:2017 Process management for avionics - Management plan - Part 2: Preparation and maintenance of an electronic COTS assembly management plan
    I.S. EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    IEC TR 61340-1:2012 Electrostatics - Part 1: Electrostatic phenomena - Principles and measurements
    BS EN 60747-16-3 : 2002 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    BS EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
    EN 62435-1:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
    EN 62258-1:2010 Semiconductor die products - Part 1: Procurement and use
    I.S. EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013 (EQV))
    DEFSTAN 81-146/1(2017) : 2017 PACKAGING, STATIC SHIELDING BAGS & DISSIPATIVE MATERIALS
    DEFSTAN 81-125/4(2015) : 2015 ELECTROSTATIC CONDUCTIVE FOAM SHEET
    I.S. EN 62435-2:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
    I.S. EN 61340-4-6:2015 ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
    UTEC 96 029 : 2011 ELECTRONIC COMPONENTS - LONG DURATION STORAGE OF ELECTRONIC COMPONENTS - GUIDE FOR IMPLEMENTATION
    BS EN 61340-4-7:2017 Electrostatics Standard test methods for specific applications. Ionization
    I.S. EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
    IEC 61340-4-7:2017 Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization
    BS EN 60747-16-1 : 2002 SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    ARINC 606A : 2004 GUIDANCE FOR ELECTROSTATIC SENSITIVE DEVICE UTILIZATION AND PROTECTION
    EN 61340-4-7:2017 Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization
    I.S. EN 61340-4-7:2017 ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION
    IEC 61340-5-1 REDLINE : 2ED 2016 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
    I.S. EN 61340-5-1:2016 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
    IEC TS 62239:2008 Process management for avionics - Preparation of an electronic components management plan
    VDI 2083 Blatt 17:2013-06 Cleanroom technology - Compatibility of materials with the required cleanliness
    BS IEC 60747-16.2 : 2001 SEMICONDUCTOR DEVICES - PART 16-2: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY PRESCALERS
    15/30315510 DC : 0 BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
    IEC 62435-4:2018 Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage
    DIN EN 61340-4-7 : 2018 ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION (IEC 61340-4-7:2017)
    08/30190157 DC : DRAFT SEP 2008 BS EN ISO 14644-9 - CLEANROOMS AND ASSOCIATED CONTROLLED ENVIRONMENTS - PART 9: CLASSIFICATION OF SURFACE PARTICLE CLEANLINESS
    09/30214337 DC : 0 BS EN 60286-3 - PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES
    BS EN 61340-5-1:2016 Electrostatics Protection of electronic devices from electrostatic phenomena. General requirements
    EN 60747-16-4:2004/A2:2017 SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES (IEC 60747-16-4:2004/A2:2017)
    I.S. EN 60286-3:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013 (EQV))
    I.S. EN 60747-16-3:2002 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    IEC 60747-16-3:2002+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-3: Microwave integrated circuits - Frequency converters
    IEC 61340-5-1:2016 RLV Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    EN 60747-16-5:2013 Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators
    PD IEC/TS 62239-2:2017 Process management for avionics. Management plan Preparation and maintenance of an electronic COTS assembly management plan
    BS EN 62435-2:2017 Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms
    14/30267228 DC : 0 BS EN 61340-5-1 ED 2.0 - ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS
    DD IEC/TS 62239:2003 Process management for avionics. Preparation of an electronic components management plan
    17/30355242 DC : 0 BS ISO 4586-5 - HIGH-PRESSURE DECORATIVE LAMINATES (HPL, HPDL) - SHEETS BASED ON THERMOSETTING RESINS (USUALLY CALLED LAMINATES) - PART 5: CLASSIFICATION AND SPECIFICATIONS FOR FLOORING GRADE LAMINATES LESS THAN 2 MM THICK INTENDED FOR BONDING TO SUPPORTING SUBSTRATES
    BS EN 60286-3:2013 Packaging of components for automatic handling Packaging of surface mount components on continuous tapes
    BS EN 62258-1:2010 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    14/30311058 DC : 0 BS EN 60747-16-1:AMD 2 - SEMICONDUCTOR DEVICES - PART 16-1: MICROWAVE INTEGRATED CIRCUITS - AMPLIFIERS
    BS EN 61340-4-6:2015 Electrostatics Standard test methods for specific applications. Wrist straps
    13/30267320 DC : 0 BS EN 61340-4-6 ED 2.0 - ELECTROSTATICS - PART 4-6: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - WRIST STRAPS
    VDE 0300-4-7 : 2018 ELECTROSTATICS - PART 4-7: STANDARD TEST METHODS FOR SPECIFIC APPLICATIONS - IONIZATION
    EN 60747-16-3:2002/A2:2017 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS (IEC 60747-16-3:2002/A2:2017)
    I.S. EN 60747-16-5:2013 SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS (IEC 60747-16-5:2013 (EQV))
    IEC 60747-16-2:2001+AMD1:2007 CSV Semiconductor devices - Part 16-2: Microwave integrated circuits - Frequency prescalers
    IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
    IEC TR 62258-3:2010 Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage
    17/30365636 DC : 0 BS EN 62239-1 ED.1.0 - PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    PD IEC/TS 62239-1:2015 PROCESS MANAGEMENT FOR AVIONICS - MANAGEMENT PLAN - PART 1: PREPARATION AND MAINTENANCE OF AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    15/30327712 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    11/30255124 DC : 0 BS EN 61191-1 - PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES
    IEC 60747-16-4:2004+AMD1:2009+AMD2:2017 CSV Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    IEC 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms
    IEC 61340-4-6:2015 Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps
    IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
    BS EN 62435-1:2017 ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL (IEC 62435-1:2017)
    CEI EN 60747-16-5 : 2014 SEMICONDUCTOR DEVICES - PART 16-5: MICROWAVE INTEGRATED CIRCUITS - OSCILLATORS
    CEI EN 60747-16-3 : 2009 SEMICONDUCTOR DEVICES - PART 16-3: MICROWAVE INTEGRATED CIRCUITS - FREQUENCY CONVERTERS
    BS EN 60747-16-4 : 2004 SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
    CEI CLC/TR 62258-3 : 2007 SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
    ISO 4586-5:2015 High-pressure decorative laminates (HPL, HPDL) Sheets based on thermosetting resins (Usually called Laminates) Part 5: Classification and specifications for flooring grade laminates less than 2 mm thick intended for bonding to supporting substrates
    I.S. EN 60747-16-4:2004 SEMICONDUCTOR DEVICES - PART 16-4: MICROWAVE INTEGRATED CIRCUITS - SWITCHES
    IEC 62258-1:2009 Semiconductor die products - Part 1: Procurement and use
    CEI EN 62258-1 : 2011 SEMICONDUCTOR DIE PRODUCTS - PART 1: PROCUREMENT AND USE
    EN 61340-4-6:2015 Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps
    EN 61191-1:2013 PRINTED BOARD ASSEMBLIES - PART 1: GENERIC SPECIFICATION - REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES USING SURFACE MOUNT AND RELATED ASSEMBLY TECHNOLOGIES (IEC 61191-1:2013)
    EN 60286-3:2013/AC:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013)
    EN 62435-2:2017 Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC TS 61340-4-2:2013 Electrostatics - Part 4-2: Standard test methods for specific applications - Electrostatic properties of garments
    IEC TS 60479-1:2005+AMD1:2016 CSV Effects of current on human beings and livestock - Part 1: Generalaspects
    IEC TR 61340-2-2:2000 Electrostatics - Part 2-2: Measurement methods - Measurement of chargeability
    IEC 61340-5-3:2015 Electrostatics - Part 5-3: Protection of electronic devices from electrostatic phenomena - Properties and requirements classification for packaging intended for electrostatic discharge sensitive devices
    IEC 61340-4-9:2016 Electrostatics - Part 4-9: Standard test methods for specific applications - Garments
    IEC 61340-4-7:2017 Electrostatics - Part 4-7: Standard test methods for specific applications - Ionization
    IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
    IEC 61340-2-3:2016 Electrostatics - Part 2-3: Methods of test for determining the resistance and resistivity of solid materials used to avoid electrostatic charge accumulation
    IEC 60749-27:2006+AMD1:2012 CSV Semiconductor devices - Mechanical and climatic test methods - Part27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)
    ESDA/JEDEC JS-002 : 2014 ELECTROSTATIC DISCHARGE SENSITIVITY TESTING - CHARGED DEVICE MODEL (CDM) - COMPONENT LEVEL
    IEC 61340-4-3:2001 Electrostatics - Part 4-3: Standard test methods for specific applications - Footwear
    IEC 61340-4-1:2003+AMD1:2015 CSV Electrostatics - Part 4-1: Standard test methods for specific applications - Electrical resistance of floor coverings and installed floors
    IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    IEC 61340-2-1:2015 Electrostatics - Part 2-1: Measurement methods - Ability of materials and products to dissipate static electric charge
    IEC 61340-4-5:2004 Electrostatics - Part 4-5: Standard test methods for specific applications - Methods for characterizing the electrostatic protection of footwear and flooring in combination with a person
    IEC 61140:2016 Protection against electric shock - Common aspects for installation and equipment
    IEC 61010-1:2010+AMD1:2016 CSV Safety requirements for electrical equipment for measurement, control, and laboratory use - Part 1: General requirements
    IEC TR 61340-1:2012 Electrostatics - Part 1: Electrostatic phenomena - Principles and measurements
    IEC TS 60479-2:2007 Effects of current on human beings and livestock - Part 2: Special aspects
    IEC 61340-4-6:2015 Electrostatics - Part 4-6: Standard test methods for specific applications - Wrist straps
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