Comment Closes On
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Committee
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EPL/501 |
Document Type
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Draft |
ISBN
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Pages
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Published
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Publisher
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British Standards Institution
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Status
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Superseded |
Superseded By
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IEC 61182-2:2006
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Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements |
IEC 61188-5-3:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides |
IEC 61188-5-2:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components |
IEC 61188-5-8:2007
|
Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) |
IEC 61188-5-6:2003
|
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides |
IEC 61188-5-1:2002
|
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements |
IEC 60194:2015
|
Printed board design, manufacture and assembly - Terms and definitions |
IEC 61188-5-5:2007
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Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides |
IEC 61188-5-4:2007
|
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides |
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