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BS CECC 00802:1991

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

View Superseded by

Harmonized system of quality assessment for electronic components. Guidance document: CECC standard method for the specification of surface mounting components (SMDs) of assessed quality

Available format(s)

Hardcopy , PDF

Superseded date

15-11-1994

Superseded by

BS CECC 00802:1994

Language(s)

English

Published date

15-11-1994

Reference set of process conditions and related test conditions to be used when compiling component specifications so that SMDs of different natures (passive, active) conforming to this standard and the appropriate component standard can be assembled and mounted on a substrate by use of a common process.

Committee
W/-
DocumentType
Standard
Pages
22
PublisherName
British Standards Institution
Status
Superseded
SupersededBy

Standards Relationship
CECC 00802 : 1994 Identical

IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
IEC 60286-3:2013 Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
MIL-STD-1189 Revision B:1989 BAR CODE SYMBOLOGY, STANDARD DEPARTMENT OF DEFENSE

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