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BS CECC 200025:1998

Current

Current

The latest, up-to-date edition.

Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

15-08-1998

€271.12
Excluding VAT

Introduction
1 General requirements
    1.1 Scope
    1.2 Definitions and abbreviations
    1.3 Related documents
    1.4 Units, symbols and terminology
    1.5 Quality system
    1.6 Rework and repair of printed board assemblies
2 Quality requirements of the process sequence
    2.1 Process description
    2.2 Quality factors
    2.3 Process specifications
    2.4 Demonstration, verification and validation
          programmes
    2.5 Maintenance programmes
    2.6 Electrical, mechanical and environmental test methods
    2.7 Identification and traceability
3 Specialist Assembly Facility documentation requirements
    3.1 Process Manual
    3.2 Process Approval reports
    3.3 Abstract of description of Process Approval
4 Audits
    4.1 General
    4.2 Audit preparation plans
    4.3 Audit checklists
    4.4 Internal audits
    4.5 External audits
5 Corrective actions and failure analysis
    5.1 Corrective actions
    5.2 Failure analysis
6 Interface between Assembly Facility and Customer
    6.1 General
    6.2 Customer enquiries, orders and contracts
    6.3 Guidance to Customer Document (GCD)
    6.4 Customer Detail Specifications
    6.5 Post-supply liaison
7 Training
    7.1 General
    7.2 Training procedures
8 Notification of modifications to capability
Annexes
    Annex A Definitions
    Annex B Form and content of process specifications
    Annex C Form and content of Process Manuals
    Annex D Format of first page of Process Approval report
    Annex E Example abstract of description of
              Process Approval
    Annex F Audit check list (technical)
    Annex G Abbreviations

Defines terms, definitions, symbols, quality system, assessment and verification procedures, together with other requirements relative to the operating of a printed board Assembly Facility to comply with the general needs of the CECC system for electronic components of assessed quality.

Committee
EPL/501
DocumentType
Standard
Pages
36
PublisherName
British Standards Institution
Status
Current

Standards Relationship
CECC 200025 : 1998 Identical

BS 6221-25:2000 Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies

IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN ISO 9002:1994/AC:1997 QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION
CECC 00114-5 : 94 AMD 2 PROCESS APPROVAL OF SPECIALIST CONTRACTORS WITHIN THE ELECTRONIC COMPONENTS INDUSTRY
EN 100114-1 : 1996 RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION
IEC 61191-1:2013 Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
IEC 61191-2:2017 Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
CECC 00200 : 2002 REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS
CECC 200 012 : 1995 PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD DESIGNED FACILITIES
CECC 00401 : 91 AMD 1 GLOSSARY OF ABBREVIATIONS, TERMS AND DEFINITIONS OF THE CECC SYSTEM
IEC 61191-3:2017 Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

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