BS CECC 200025:1998
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Process assessment schedule: printed board assembly facilities
Hardcopy , PDF
English
15-08-1998
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Introduction
1 General requirements
1.1 Scope
1.2 Definitions and abbreviations
1.3 Related documents
1.4 Units, symbols and terminology
1.5 Quality system
1.6 Rework and repair of printed board assemblies
2 Quality requirements of the process sequence
2.1 Process description
2.2 Quality factors
2.3 Process specifications
2.4 Demonstration, verification and validation
programmes
2.5 Maintenance programmes
2.6 Electrical, mechanical and environmental test methods
2.7 Identification and traceability
3 Specialist Assembly Facility documentation requirements
3.1 Process Manual
3.2 Process Approval reports
3.3 Abstract of description of Process Approval
4 Audits
4.1 General
4.2 Audit preparation plans
4.3 Audit checklists
4.4 Internal audits
4.5 External audits
5 Corrective actions and failure analysis
5.1 Corrective actions
5.2 Failure analysis
6 Interface between Assembly Facility and Customer
6.1 General
6.2 Customer enquiries, orders and contracts
6.3 Guidance to Customer Document (GCD)
6.4 Customer Detail Specifications
6.5 Post-supply liaison
7 Training
7.1 General
7.2 Training procedures
8 Notification of modifications to capability
Annexes
Annex A Definitions
Annex B Form and content of process specifications
Annex C Form and content of Process Manuals
Annex D Format of first page of Process Approval report
Annex E Example abstract of description of
Process Approval
Annex F Audit check list (technical)
Annex G Abbreviations
Defines terms, definitions, symbols, quality system, assessment and verification procedures, together with other requirements relative to the operating of a printed board Assembly Facility to comply with the general needs of the CECC system for electronic components of assessed quality.
| Committee |
EPL/501
|
| DocumentType |
Standard
|
| Pages |
36
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| CECC 200025 : 1998 | Identical |
| BS 6221-25:2000 | Printed wiring boards Guide to the rework and repair of soldered surface mounted printed board assemblies |
| IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
| EN ISO 9002:1994/AC:1997 | QUALITY SYSTEMS - SPECIFICATION FOR PRODUCTION AND INSTALLATION |
| CECC 00114-5 : 94 AMD 2 | PROCESS APPROVAL OF SPECIALIST CONTRACTORS WITHIN THE ELECTRONIC COMPONENTS INDUSTRY |
| EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
| IEC 61191-1:2013 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies |
| IEC 61191-2:2017 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies |
| CECC 00200 : 2002 | REGISTER OF FIRMS, PRODUCTS AND SERVICES APPROVED UNDER CECC CERTIFICATION SYSTEM FOR ELECTRONIC COMPONENTS |
| CECC 200 012 : 1995 | PROCESS ASSESSMENT SCHEDULE: PRINTED BOARD DESIGNED FACILITIES |
| CECC 00401 : 91 AMD 1 | GLOSSARY OF ABBREVIATIONS, TERMS AND DEFINITIONS OF THE CECC SYSTEM |
| IEC 61191-3:2017 | Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies |
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