BS EN 175101-802:2000
Current
Current
The latest, up-to-date edition.
Harmonized system of quality assessment for electronic components. Detail specification Two-part connectors for printed boards for high number of contacts with basic grid of 2,54 mm on 3 or 4 rows
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
15-04-2000
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Scope
2 Normative references
3 Type designation
4 Common features
5 Dimensions
6 Gauges
7 Characteristics
8 Tests
9 Quality assessment procedures
10 Ordering information
| Committee |
EPL/48
|
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Standards | Relationship |
| SN EN 175101-802 : 1999 | Identical |
| NEN EN 175101-802 : 2000 | Identical |
| DIN EN 175101-802:2000-09 | Identical |
| I.S. EN 175101-802:2000 | Identical |
| EN 175101-802:1999 | Identical |
| NF EN 175101-802 : 2002 | Identical |
| IEC 60512-8:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 8: Connector tests (mechanical) and mechanical tests on contacts and terminations |
| IEC 60512-6:1984 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 6: Climatic tests and soldering tests |
| IEC 60512-7:1993 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 7: Mechanical operating tests and sealing tests |
| IEC 60097:1991 | Grid systems for printed circuits |
| IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| ISO 468:1982 | Surface roughness — Parameters, their values and general rules for specifying requirements |
| IEC 60947-1:2007+AMD1:2010+AMD2:2014 CSV | Low-voltage switchgear and controlgear - Part 1: General rules |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| IEC 60512-4:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 4: Dynamic stress tests |
| IEC 60512-9:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 9: Miscellaneous tests |
| IEC 60512-5:1992 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods - Part 5: Impact tests (free components), static load tests (fixed components), endurance tests and overload tests |
| IEC 60512-1:2001 | Connectors for electronic equipment - Tests and measurements - Part 1: General |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| IEC 60512-3:1976 | Electromechanical components for electronic equipment; basic testing procedures and measuring methods. Part 3: Current-carrying capacity tests |
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