BS EN 60068-2-82:2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing Tests. Test Tx. Whisker test methods for electronic and electric components
Hardcopy , PDF
12-07-2019
English
31-07-2007
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
4.1 Desiccator
4.2 Humidity chamber
4.3 Thermal cycling chamber
4.4 Optical microscope
4.5 Scanning electron microscope microscopy
4.6 Fixing jig
5 Preparation for test
5.1 General
5.2 Selection of test methods
5.3 Storage conditions prior to testing
5.4 Handling of the specimen
5.5 Preconditioning by heat treatment
5.6 Specimen preparation by leads forming
6 Test condition
6.1 Ambient test
6.2 Damp heat test
6.3 Temperature cycling test
7 Test schedule
7.1 Procedure for test method selection
7.2 Initial measurement
7.3 Test
7.4 Recovery
7.5 Intermediate or final assessment
8 Information to be given in the relevant specification
9 Minimum requirements for a test report
Annex A (normative) Measurement of the whisker length
Annex B (informative) Examples of whiskers
Annex C (informative) Guidance on the sample lots and test
schedules
Annex D (informative) Guidance on acceptance criteria
Annex E (informative) Background on whisker growth
Annex F (informative) Background on ambient test
Annex G (informative) Background on damp heat test
Annex H (informative) Background on temperature cycling test
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
Bibliography
Describes whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish.
Committee |
EPL/501
|
DevelopmentNote |
Supersedes 05/30133273 DC. (07/2007)
|
DocumentType |
Standard
|
Pages |
36
|
PublisherName |
British Standards Institution
|
Status |
Superseded
|
SupersededBy | |
Supersedes |
IEC 60068-2-82:2007 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress. This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable. The contents of the corrigendum of December 2009 have been included in this copy.
Standards | Relationship |
I.S. EN 60068-2-82:2007 | Identical |
NF EN 60068-2-82 : 2013 | Identical |
UNE-EN 60068-2-82:2007 | Identical |
NBN EN 60068-2-82 : 2007 | Identical |
DIN EN 60068-2-82:2007-12 | Identical |
IEC 60068-2-82:2007 | Identical |
EN 60068-2-82:2007 | Identical |
IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages |
HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
IEC 61192-3:2002 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
EN 61760-1:2006 | SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS) |
IEC 61760-1:2006 | Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) |
EN 61192-3:2003 | Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies |
EN 60068-2-78:2013 | Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state |
IEC 60068-3-4:2001 | Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests |
IEC 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
EN 60068-2-14:2009 | Environmental testing - Part 2-14: Tests - Test N: Change of temperature |
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