• Shopping Cart
    There are no items in your cart

BS EN 60191-6-17:2011

Current

Current

The latest, up-to-date edition.

Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-06-2011

€231.38
Excluding VAT

INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Terminal position numbering
5 Drawings
6 Dimensions
7 Dimension table
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Gives outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Committee
EPL/47
DevelopmentNote
Supersedes 07/30155531 DC. (07/2011)
DocumentType
Standard
Pages
32
PublisherName
British Standards Institution
Status
Current
Supersedes

IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.

Standards Relationship
IEC 60191-6-17:2011 Identical
EN 60191-6-17:2011 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
EN 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.