BS EN 60749-19 : 2003
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
Hardcopy , PDF
English
01-01-2003
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Foreword
1 Scope
2 Description of the test apparatus
3 Test method
4 Failure criteria
5 Requirements
6 Categories of separation
7 Summary
Specifies the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term "semiconductor die" should be taken to include passive elements). It also applicable to cavity packages or as a process monitor.
| Committee |
EPL/47
|
| DevelopmentNote |
Supersedes 00/203597 DC (07/2003) Supersedes BS EN 60749. (09/2005) 2003 Edition Re-Issued in October 2010 & incorporates AMD 1 2010. Supersedes 09/30208058 DC. (11/2010)
|
| DocumentType |
Standard
|
| Pages |
10
|
| PublisherName |
British Standards Institution
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| DIN EN 60749-19:2011-01 | Identical |
| NF EN 60749-19 : 2003 AMD 1 2011 | Identical |
| EN 60749-19:2003/A1:2010 | Identical |
| UNE-EN 60749-19:2003 | Identical |
| NBN EN 60749-19 : 2004 AMD 1 2010 | Identical |
| IEC 60749-19:2003+AMD1:2010 CSV | Identical |
| SN EN 60749-19 : 2003 | Identical |
| I.S. EN 60749-19:2003 | Identical |
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