Skip to content
Please enter a keyword to search

  • BS EN 60749-19 : 2003

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2003

    Publisher:  British Standards Institution

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    Foreword
    1 Scope
    2 Description of the test apparatus
    3 Test method
    4 Failure criteria
    5 Requirements
    6 Categories of separation
    7 Summary

    Abstract - (Show below) - (Hide below)

    Specifies the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term "semiconductor die" should be taken to include passive elements). It also applicable to cavity packages or as a process monitor.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/47
    Development Note Supersedes 00/203597 DC (07/2003) Supersedes BS EN 60749. (09/2005) 2003 Edition Re-Issued in October 2010 & incorporates AMD 1 2010. Supersedes 09/30208058 DC. (11/2010)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective