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BS EN 60749-25:2003

Current

Current

The latest, up-to-date edition.

Semiconductor devices. Mechanical and climatic test methods Temperature cycling

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-10-2003

€156.59
Excluding VAT

1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Procedure
  5.1 Initial measurements
  5.2 Conditioning
  5.3 Cycle rates
  5.4 Upper and lower soak times
  5.5 Upper and lower soak temperatures
  5.6 Soak modes
  5.7 Cycle time
  5.8 Ramp rate
  5.9 Load transfer time
  5.10 Recovery
  5.11 Final measurements
  5.12 Failure criteria
6 Summary
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes.

Committee
EPL/47
DevelopmentNote
Supersedes 02/204668 DC. (11/2003) Supersedes BS EN 60749. (09/2005)
DocumentType
Standard
Pages
16
PublisherName
British Standards Institution
Status
Current
Supersedes

Provides a test procedure for determining the ability of semiconductor devices and components and/or board assemblies to withstand mechanical stresses induced by alternating high and low temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses. Applies to single, dual and triple chamber temperature cycling and covers component and solder interconnection testing.

Standards Relationship
EN 60068-2-30:1999 Identical
UNE-EN 60749-25:2004 Identical
EN 60749-25:2003 Identical
NF EN 60749-25 : 2003 Identical
DIN EN 60749-25:2004-04 Identical
SN EN 60749-25 : 2003 Identical
NBN EN 60749-25 : 2004 Identical
I.S. EN 60749-25:2003 Identical
IEC 60749-25:2003 Identical

IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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