CECC 200025 : 1998

Introduction
1 General requirements
    1.1 Scope
    1.2 Definitions and abbreviations
    1.3 Related documents
    1.4 Units, symbols and terminology
    1.5 Quality system
    1.6 Rework and repair of printed board assemblies
2 Quality requirements of the process sequence
    2.1 Process description
    2.2 Quality factors
    2.3 Process specifications
    2.4 Demonstration, verification and validation
          programmes
    2.5 Maintenance programmes
    2.6 Electrical, mechanical and environmental test methods
    2.7 Identification and traceability
3 Specialist Assembly Facility documentation requirements
    3.1 Process Manual
    3.2 Process Approval reports
    3.3 Abstract of description of Process Approval
4 Audits
    4.1 General
    4.2 Audit preparation plans
    4.3 Audit checklists
    4.4 Internal audits
    4.5 External audits
5 Corrective actions and failure analysis
    5.1 Corrective actions
    5.2 Failure analysis
6 Interface between Assembly Facility and Customer
    6.1 General
    6.2 Customer enquiries, orders and contracts
    6.3 Guidance to Customer Document (GCD)
    6.4 Customer Detail Specifications
    6.5 Post-supply liaison
7 Training
    7.1 General
    7.2 Training procedures
8 Notification of modifications to capability
Annexes
    Annex A Definitions
    Annex B Form and content of process specifications
    Annex C Form and content of Process Manuals
    Annex D Format of first page of Process Approval report
    Annex E Example abstract of description of
              Process Approval
    Annex F Audit check list (technical)
    Annex G Abbreviations

Defines terms, definitions, symbols, quality system, assessment and verification procedures, together with other requirements relative to the operating of a printed board Assembly Facility to comply with the general needs of the CECC system for electronic components of assessed quality.