CEI CLC/TR 62258-3 : 2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
Hardcopy , PDF
English
01-01-2007
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of bare
die and wafers
10 Good practice for automated handling during assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.