CEI CLC/TR 62258-3 : 2007
Current
The latest, up-to-date edition.
SEMICONDUCTOR DIE PRODUCTS - PART 3: RECOMMENDATIONS FOR GOOD PRACTICE IN HANDLING, PACKING AND STORAGE
Hardcopy , PDF
English
01-01-2007
Important note : Users cannot be edited or removed once added to your Multi user PDF.
FOREWORD
INTRODUCTION
1 Scope and object
2 Normative references
3 Terms and definitions
4 Handling - Good practice
5 Process handling issues
6 Die and wafer transport and storage media
7 Storage good practice
8 Traceability good practice
9 Guidelines for long-term storage (die banking) of bare
die and wafers
10 Good practice for automated handling during assembly
Annex A (informative) - Planning checklist
Annex B (informative) - Material specifications
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Pertains to facilitate the production, supply and use of semiconductor die products, including: - wafers, - singulated bare die, - die and wafers with attached connection structures, and - minimally or partially encapsulated die and wafers.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-54. (04/2007)
|
| DocumentType |
Standard
|
| Pages |
52
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| CLC/TR 62258-3:2007 | Identical |
| EN 61340-5-1:2016/AC:2017-05 | ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017) |
| IEC 61340-5-1:2016 | Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements |
| IEC 62258-1:2009 | Semiconductor die products - Part 1: Procurement and use |
| IEC TR 61340-5-2:2007 | Electrostatics - Part 5-2: Protection of electronic devices from electrostatic phenomena - User guide |
| EN 62258-1:2010 | Semiconductor die products - Part 1: Procurement and use |
| EN 60286-3:2013/AC:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 3: PACKAGING OF SURFACE MOUNT COMPONENTS ON CONTINUOUS TAPES (IEC 60286-3:2013) |
| IEC 62258-2:2011 | Semiconductor die products - Part 2: Exchange data formats |
| ISO 14644-1:2015 | Cleanrooms and associated controlled environments Part 1: Classification of air cleanliness by particle concentration |
| EN 61340-5-2:2001/corrigendum:2001 | ELECTROSTATICS - PART 5-2: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - USER GUIDE |
| IEC 60286-3:2013 | Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes |
| EN ISO 14644-1:2015 | Cleanrooms and associated controlled environments - Part 1: Classification of air cleanliness by particle concentration (ISO 14644-1:2015) |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.