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CEI EN 60191-6-21 : 2011
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Current
The latest, up-to-date edition.
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MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-21: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - MEASURING METHODS FOR PACKAGE DIMENSIONS OF SMALL OUTLINE PACKAGES (SOP)
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2011
Publisher
FOREWORD
1. Scope
2. Normative references
3. Terms and definitions
4. Measuring methods
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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