IEC 61076-1:2006
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Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
EN 61076-4-001 : 1996
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CONNECTORS WITH ASSESSED QUALITY, FOR USE IN D.C., LOW-FREQUENCY ANALOGUE AND IN DIGITAL HIGH SPEED DATA APPLICATIONS - PART 4: PRINTED BOARD CONNECTORS - SECTION 001: BLANK DETAIL SPECIFICATION |
EN 60917-2-2 : 1996
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MODULAR ORDER FOR THE DEVELOPMENT OF MECHANICAL STRUCTURES FOR ELECTRONIC EQUIPMENT PRACTICES - SECTIONAL SPECIFICATION - INTERFACE CO-ORDINATION DIMENSIONS FOR THE 25 MM EQUIPMENT PRACTICE - DETAIL SPECIFICATION - DIMENSIONS FOR SUBRACKS, CHASSIS, BACKPLANES, FRONT PANELS AND PLUG-IN UNITS |
EN 60352-2:2006/A1:2013
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SOLDERLESS CONNECTIONS - PART 2: CRIMPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
IEC 60352-3:1993
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Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance |
IEC 61076-4-100:2001
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Connectors for electronic equipment - Part 4-100: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes |
IEC 60068-1:2013
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Environmental testing - Part 1: General and guidance |
EN 60512-1-100:2012
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CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 1-100: GENERAL - APPLICABLE PUBLICATIONS (IEC 60512-1-100:2012) |
EN 60352-3 : 1994
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SOLDERLESS CONNECTIONS - SOLDERLESS ACCESSIBLE INSULATION DISPLACEMENT CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
IEC 60068-2-21:2006
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Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
EN 60068-1:2014
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ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013) |
EN 61076-4:1996
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CONNECTORS WITH ASSESSED QUALITY, FOR USE IN D.C., LOW FREQUENCY ANALOGUE AND IN DIGITAL HIGH-SPEED DATA APPLICATIONS - PART 4: SECTIONAL SPECIFICATION - PRINTED BOARD CONNECTORS |
EN 61076-1:2006
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CONNECTORS FOR ELECTRONIC EQUIPMENT - PRODUCT REQUIREMENTS - PART 1: GENERIC SPECIFICATION |
EN 61076-4-100 : 2001
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CONNECTORS FOR ELECTRONIC EQUIPMENT - PART 4-100: PRINTED BOARD CONNECTORS WITH ASSESSED QUALITY - DETAIL SPECIFICATION FOR TWO-PART CONNECTOR MODULES HAVING A GRID OF 2.5 MM FOR PRINTED BOARDS AND BACKPLANES |
IEC 60352-1:1997
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Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
IEC 60410:1973
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Sampling plans and procedures for inspection by attributes |
EN 60352-5:2012/AC:2014
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SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012) |
ISO 1302:2002
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Geometrical Product Specifications (GPS) Indication of surface texture in technical product documentation |
IEC 60352-5:2012
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Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
IEC 61076-4:1995
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Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
IEC 60512-1-100:2012
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Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
EN 60068-2-21:2006
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ENVIRONMENTAL TESTING - PART 2-21: TESTS - TEST U: ROBUSTNESS OF TERMINATIONS AND INTEGRAL MOUNTING DEVICES |
IEC 60917-2-2:1994
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Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units |
IEC 60352-2:2006+AMD1:2013 CSV
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Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance |
EN 61076-4-108 : 2002
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CONNECTORS FOR ELECTRONIC EQUIPMENT - PRINTED BOARD CONNECTORS WITH ASSESSED QUALITY - DETAIL SPECIFICATION FOR CABLE-TO-BOARD CONNECTORS, WITH A MODULAR PITCH OF 25 MM AND INTEGRATED SHIELDING FUNCTION, APPLICABLE FOR TRANSVERSE PACKING DENSITY OF 15 MM, HAVING A BASIC GRID OF 2,5 MM IN ACCORDANCE WITH IEC 60917-1 |
EN 60352-1 : 1997
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SOLDERLESS CONNECTIONS - WRAPPED CONNECTION - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
IEC 60326-3:1991
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Printed boards - Part 3: Design and use of printed boards |
IEC 60917-1:1998+AMD1:2000 CSV
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Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard |
IEC 61076-4-001:1996
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Connectors with assessed quality, for use in d.c., low-frequencyanalogue and in digital high-speed data applications - Part 4:Printed board connectors - Section 001: Blank detail specification |