CEI EN 61076-4-108 : 2003
Current
Current
The latest, up-to-date edition.
CONNECTORS FOR ELECTRONIC EQUIPMENT PART 4-108: PRINTED BOARD CONNECTORS WITH ASSESSED QUALITY DETAIL SPECIFICATION FOR CABLE-TO-BOARD CONNECTORS, WITH A MODULAR PITCH OF 25 MM AND INTEGRATED SHIELDING FUNCTION, APPLICABLE FOR TRANSVERSE PACKING DENSITY OF 15 MM, HAVING A BASIC GRID OF 2,5 MM IN ACCORDANCE WITH IEC 60917-1
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-01-2003
Publisher
FOREWORD
1 General data
2 Technical information
3 Dimensional information
4 Characteristics
5 Test schedule
6 Quality assessment procedures
Annex A (informative) - Shielding
effectiveness
Annex ZA (normative) - Normative
references to international
publications With their
corresponding European
publications
Defines a test procedure which was used to determine the shielding effectiveness from electromagnetic fields for the cable connector system.
| Committee |
CT 48
|
| DevelopmentNote |
Classificazione CEI 48-90 (06/2003)
|
| DocumentType |
Standard
|
| Pages |
78
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61076-4-108:2002 | Identical |
| IEC 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
| EN 61076-4-001:1996 | Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Printed board connectors - Section 001: Blank detail specification |
| EN 60917-2-2:1996 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units |
| EN 60352-2:2006/A1:2013 | SOLDERLESS CONNECTIONS - PART 2: CRIMPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
| IEC 60352-3:1993 | Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance |
| IEC 61076-4-100:2001 | Connectors for electronic equipment - Part 4-100: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
| EN 60352-3:1994 | Solderless connections - Part 3: Solderless accessible insulation displacement connections - General requirements, test methods and practical guidance |
| IEC 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| EN 61076-4:1996 | Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
| EN 61076-1:2006 | Connectors for electronic equipment - Product requirements - Part 1: Generic specification |
| EN 61076-4-100:2001 | Connectors for electronic equipment - Part 4-100: Printed board connectors with assessed quality - Detail specification for two-part connector modules having a grid of 2,5 mm for printed boards and backplanes |
| IEC 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| IEC 60410:1973 | Sampling plans and procedures for inspection by attributes |
| EN 60352-5:2012/AC:2014 | SOLDERLESS CONNECTIONS - PART 5: PRESS-IN CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE (IEC 60352-5:2012) |
| ISO 1302:2002 | Geometrical Product Specifications (GPS) Indication of surface texture in technical product documentation |
| IEC 60352-5:2012 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance |
| IEC 61076-4:1995 | Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications - Part 4: Sectional specification - Printed board connectors |
| IEC 60512-1-100:2012 | Connectors for electronic equipment - Tests and measurements - Part 1-100: General - Applicable publications |
| EN 60068-2-21:2006 | Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices |
| IEC 60917-2-2:1994 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 2: Detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units |
| IEC 60352-2:2006+AMD1:2013 CSV | Solderless connections - Part 2: Crimped connections - Generalrequirements, test methods and practical guidance |
| EN 61076-4-108:2002 | Connectors for electronic equipment - Part 4-108: Printed board connectors with assessed quality - Detail specification for cable-to-board connectors, with a modular pitch of 25 mm and integrated shielding function, applicable for transverse packing density of 15 mm, having a basic grid of 2,5 mm in accordance with IEC 60917-1 |
| EN 60352-1:1997 | Solderless connections - Part 1: Wrapped connections - General requirements, test methods and practical guidance |
| IEC 60326-3:1991 | Printed boards - Part 3: Design and use of printed boards |
| IEC 60917-1:1998+AMD1:2000 CSV | Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard |
| IEC 61076-4-001:1996 | Connectors with assessed quality, for use in d.c., low-frequencyanalogue and in digital high-speed data applications - Part 4:Printed board connectors - Section 001: Blank detail specification |
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