EN 160100 : 1997

FOREWORD
1 General
  1.1 Scope
  1.2 Related documents
  1.3 Units, symbols and terminology
      1.3.1 Printed circuit (IEC 194)
      1.3.2 Printed board (IEC 194)
      1.3.3 Printed board assembly (IEC 194)
      1.3.4 Pin-in-hole assembly (PIH)
      1.3.5 Surface mounting assembly (SMA) or surface
             mounting technology (SMT)
      1.3.6 Rework (RP14: Part III and 1.4)
      1.3.7 Rework (RP14: Part III and 1.5)
  1.4 Marking of the printed board assembly and
      package
2 Quality assessment procedures
  2.1 General
      2.1.1 Eligibility for capability approval
             (subsection 2.1 RP 14: Part III)
      2.1.2 Primary stage of manufacture
      2.1.3 Structural similarity
      2.1.4 Subcontracting
      2.1.5 Incorporated components (subsection 2.3
             RP 14: Part III)
      2.1.6 Validity of release
  2.2 Procedures for capability approval
      2.2.1 Application for capability approval
             (subsection 2.4 RP 14: Part III)
      2.2.2 Granting of capability approval
      2.2.3 Description of capability (subsection
             2.5 RP 14: Part III)
      2.2.4 Capability qualifying components (CQCs)
      2.2.5 Demonstration and verification of
             capability
      2.2.6 Procedure to be followed in the event of
             CQC failures (subsection 2.6 and
             and subsection 2.10 RP 14: Part III)
      2.2.7 Abstract of description of capability
  2.3 Procedures following the granting of capability
      approval
      2.3.1 Maintenance of capability approval
             (see subsection 2.9 of RP 14: Part III)
      2.3.2 Modifications likely to affect the validity
             of the capability approval (subsection
             2.11 of RP 14: Part III)
  2.4 Release for delivery
      2.4.1 Quality conformance inspection requirements
             (subsection 3.1 of RP 14: Part III)
      2.4.2 Customer detail specification
      2.4.3 Detail specifications for standard
             catalogue items to be included in the
             qualified products list (QPL)
3 Test and measurement procedures
  3.1 Test and measurement conditions
      3.1.1 Standard atmospheric conditions for
             testing and for electrical measurements
      3.1.2 Standard atmospheric conditions for
             referee tests
  3.2 Measurement uncertainty
  3.3 Alternative test methods including the use of
      production tests
      3.3.1 Analogous tests
      3.3.2 Referee tests
  3.4 Visual inspection
      3.4.1 General
      3.4.2 Mechanical component mounting acceptability
             requirements
      3.4.3 Lead forming
      3.4.4 Component orientation and alignment
      3.4.5 Soldering acceptability - conventional
             components and terminals
      3.4.6 Surface mount assemblies
      3.4.7 Soldering acceptability - surface mounted
             components
      3.4.8 Cleanliness
      3.4.9 Conformal coatings and encapsulants
      3.4.10 Solder resists and markings
  3.5 Dimensioning and gauging
  3.6 Electrical test procedures
      3.6.1 Cleanliness testing
  3.7 Mechanical test procedures
  3.8 Environmental and endurance testing and screening
      3.8.1 Temperature
      3.8.2 Damp heat, cyclic
      3.8.3 Shock
      3.8.4 Vibration (sinusoidal)
      3.8.5 Other tests
Annex A (informative) Sample flow chart and general plan for
                      selection of CQCs
Annex B (normative) Example layout of an abstract of description
                      of capability for inclusion in CECC 00 200

Deals with printed board assemblies of assessed quality which meet criteria for a modular electronic unit as specified in the generic specification EN 160000. Applicable to both custom built products and to standard catalogue items, and specifies the characteristics for assessment and test procedures for use for capability approval, quality conformance inspection (lot-by-lot) and approval maintenance. SHOULD BE READ IN CONJUNCTION WITH EN 160000.