EN 60068-2-67:1996
Current
The latest, up-to-date edition.
Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
10-01-1996
Foreword
1 Scope
2 General description
3 Description of test apparatus
4 Severities
5 Pre-conditioning
6 Initial measurements
7 Testing
8 Intermediate measurements
9 Recovery
10 Final measurements
11 Information to be given in the relevant specification
Annexes
A (informative) Physical significance of the test
B (informative) Test apparatus and handling
Provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically sealed components, to the deteriorative effect of damp heat. The test is not intended to evaluate external effects such as corrosion and deformation. A le statut d`une publication fondamentale de sécurité conformément au Guide 104 de la CEI.
Committee |
CLC/SR 104
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Standards | Relationship |
IEC 60068-2-67:1995 | Identical |
BS EN 60068-2-67:1996 | Identical |
SN EN 60068-2-67 : 1996 | Identical |
DIN EN 60068-2-67:1996-07 | Identical |
I.S. EN 60068-2-67:1997 | Identical |
PN EN 60068-2-67 : 2004 | Identical |
CEI EN 60068-2-67 : 1997 | Identical |
NF EN 60068 2-67 : 1998 | Identical |
NBN EN 60068 2-67 : 1996 | Identical |
UNE-EN 60068-2-67:1997 | Identical |
I.S. EN 60068-2-67:1996/A1:2019 | Identical |
NF EN 60068-2-67:1998 | Identical |
ONORM OVE EN 60068-2-67 : 1998 | Identical |
BS EN 60384-1:2016 | Fixed capacitors for use in electronic equipment Generic specification |
EN 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 5-503: General test method for materials and assemblies - Conductive anodic filaments (CAF) testing of circuit boards |
BS EN IEC 61189-5-503:2017 | Test methods for electrical materials, printed board and other interconnection structures and assemblies General test method for materials and assemblies. Conductive anodic filaments (CAF) testing of circuit boards |
BS EN 60115-1 : 2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
VDI/VDE 5570 Blatt 3:2017-06 | Testing of connectorised and non-connectorised polymer optical fibres (POF) - Testing of mechanical characteristics, environmental influences and aging behaviour |
I.S. EN 60115-1:2011 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED) |
CEI EN 61189-5-503 : 1ED 2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
I.S. EN 61189-5-503:2017 | TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARD AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 5-503: GENERAL TEST METHOD FOR MATERIALS AND ASSEMBLIES - CONDUCTIVE ANODIC FILAMENTS (CAF) TESTING OF CIRCUIT BOARDS |
EN 60384-1:2016 | Fixed capacitors for use in electronic equipment - Part 1: Generic specification |
EN 60115-1:2011/A11:2015 | FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION |
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