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  • EN 60115-1:2011/A11:2015

    Current The latest, up-to-date edition.

    FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION

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    Language(s): 

    Published date:  08-05-2015

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    1 General
    2 Technical data
    3 Quality assessment procedures
    4 Test and measurement procedures
    Annex B (normative) - Rules for the preparation of detail
            specifications for resistors and capacitors for
            electronic equipment for use within the IECQ
            system
    Annex C (informative) - Example of test equipment for the
            periodic-pulse high-voltage overload test
    Annex F (informative) - Letter symbols and abbreviations
    Annex G (informative) - Index table for test and measurement
            procedures
    Annex Q (normative) - Quality assessment procedures
    Annex ZA (informative) - Example of a certified test record
    Annex ZR (normative) - Failure rate level evaluation,
             determination and qualification
    Annex ZX (informative) - Cross reference

    Abstract - (Show below) - (Hide below)

    IEC 60115-1: 2008(E) is a generic specification and is applicable to fixed resistors for use in electronic equipment.

    General Product Information - (Show below) - (Hide below)

    Committee TC 40XB
    Development Note Supersedes EN 140000. (05/2002)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    06/30155911 DC : DRAFT SEP 2006 BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    BS EN 140101:2008 Blank Detail Specification. Fixed low power film resistors
    I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    EN 140400:2003 Sectional specification: Fixed low power surface mount (SMD) resistors
    EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2
    EN 140101:2008 Blank Detail Specification: Fixed low power film resistors
    EN 60115-2:2015 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
    EN 60115-9-1 : 2004 Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification - Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ
    EN 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    EN 140401:2009 Blank Detail Specification: Fixed low power film surface mount (SMD) resistors
    EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    BS EN 60115-9-1:2004 Fixed resistors for use in electronic equipment Blank detail specification. Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ
    BS EN 60115-8-1:2015 Fixed resistors for use in electronic equipment Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
    I.S. EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 140100:2008 SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS
    I.S. EN 60115-9:2004 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS
    BS EN 60115-2:2015 Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors
    CEI EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    14/30312344 DC : 0 PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    14/30311384 DC : 0 BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    BS EN 140401-801 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    BS EN 140401-803 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    I.S. EN 60115-2:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    06/30155922 DC : 0 BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS
    16/30338234 DC : 0 BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    06/30155905 DC : DRAFT SEP 2006 BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    14/30317306 DC : 0 BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    BS EN 140400:2003 Harmonized system of quality assessment for electronic components. Sectional specification. Fixed low power surface mount (SMD) resistors
    I.S. EN 140401-804:2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 140101-806:2009 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
    I.S. EN 140400:2004 SECTIONAL SPECIFICATION: FIXED LOW POWER SURFACE MOUNTING (SMD) RESISTORS
    BS EN 140401-804 : 2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    BS EN 140401:2009 Blank Detail Specification. Fixed low power film surface mount (SMD) resistors
    EN 140401-804:2011/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    02/203178 DC : 0 PREN 140101-806 - DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE WOUND RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS - ASSESSMENT LEVEL Z - VERSION A: WITH 100-%-TEST - VERSION E: WITH FAILURE RATE LEVEL AND 100-%-TEST - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    BS EN 140100:2008 Sectional specification. Fixed low power film resistors
    BS EN 60115-8:2012 Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistors
    10/30237986 DC : 0 BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    08/30186808 DC : DRAFT JULY 2008 BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
    BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    I.S. EN 140101:2008 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS
    CEI EN 60115-9 : 2005 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS
    EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    BS EN 140402-801:2015 Detail specification: Fixed low power wirewound surface mount (SMD) resistors. Rectangular. Stability classes 0,5; 1; 2
    CEI EN 60115-2 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    CEI EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    CEI EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    BS EN 60115-9:2004 Fixed resistors for use in electronic equipment Sectional specification. Fixed surface mount resistor networks with individually measurable resistors
    05/30129971 DC : DRAFT FEB 2005 EN 140402-801 - DETAIL SPECIFICATION - FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    CEI EN 60115-9-1 : 2005 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9-1: BLANK DETAIL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS - ASSESSMENT LEVEL EZ
    BS EN 140101-806 : 2008 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
    I.S. EN 60115-9-1:2004 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9-1: BLANK DETAIL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS - ASSESSMENT LEVEL EZ
    I.S. EN 140401-801:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    EN 140401-803 : 2007 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    EN 140101-806 : 2008 COR 2014 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
    EN 140401-801:2007/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    BS EN 61188-5-2:2003 Printed boards and assemblies. Design and use. Attachment (land/joint) considerations Discrete components
    EN 60115-9:2004 Fixed resistors for use in electronic equipment - Part 9: Sectional specification - Fixed surface mount resistor networks with individually measurable resistors
    EN 60115-8:2012 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
    EN 60115-8-1:2015 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    EN 140100:2008 Sectional Specification: Fixed low power film resistors

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
    IEC 61249-2-7:2002 Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
    EN 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-13:1983 Basic environmental testing procedures - Part 2-13: Tests - Test M: Low air pressure
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    EN 60060-1:2010 High-voltage test techniques - Part 1: General definitions and test requirements
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 60068-2-11:1981 Basic environmental testing procedures - Part 2-11: Tests - Test Ka: Salt mist
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    EN 60027-1:2006/A2:2007 LETTER SYMBOLS TO BE USED IN ELECTRICAL TECHNOLOGY - PART 1: GENERAL
    IECQ 001002-2:1998 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 2: DOCUMENTATION
    EN 61249-2-35:2009 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 60027-1:1992 Letters symbols to be used in electrical technology - Part 1: General
    EN 61249-2-7:2002/corrigendum:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 60068-2-67:1995 Environmental testing - Part 2-67: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
    EN 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 60410:1973 Sampling plans and procedures for inspection by attributes
    EN 60068-2-27:2009 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    IEC 60294:2012 Measurement of the dimensions of a cylindrical component with axial terminations
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    EN 61193-2 : 2007 QUALITY ASSESSMENT SYSTEMS - PART 2: SELECTION AND USE OF SAMPLING PLANS FOR INSPECTION OF ELECTRONIC COMPONENTS AND PACKAGES
    EN 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    EN 60068-2-67:1996 Environmental testing - Part 2: Tests - Test Cy: Damp heat, steady state, accelerated test primarily intended for components
    IEC TR 60440:1973 Method of measurement of non-linearity in resistors
    EN 61340-3-1:2007 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
    IEC 60062:2016 Marking codes for resistors and capacitors
    EN 60062:2016/AC:2016-12 MARKING CODES FOR RESISTORS AND CAPACITORS (IEC 60062:2016/COR1:2016)
    ISO 80000-1:2009 Quantities and units — Part 1: General
    IEC 61249-2-35:2008 Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
    IEC 61340-3-1:2006 Electrostatics - Part 3-1: Methods for simulation of electrostatic effects - Human body model (HBM) electrostatic discharge test waveforms
    EN 60068-2-78:2013 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
    EN 60068-2-13:1999 Environmental testing - Part 2: Tests - Test M: Low air pressure
    EN 60068-2-6:2008 Environmental testing - Part 2-6: Tests - Test Fc: Vibration (sinusoidal)
    IEC 60063:2015 Preferred number series for resistors and capacitors
    EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
    EN 60068-2-82:2007 Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components
    EN 60068-2-11:1999 Environmental testing - Part 2: Tests - Test Ka: Salt mist
    EN 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IECQ 210000:1995 TECHNOLOGY APPROVAL SCHEDULES - REQUIREMENTS UNDER THE IECQ QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ)
    IEC 61249-2-22:2005 Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
    IEC 60060-1:2010 High-voltage test techniques - Part 1: General definitions and test requirements
    EN 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
    EN 60695-11-5:2017 Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
    IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
    IEC 60695-11-5:2016 Fire hazard testing - Part 11-5: Test flames - Needle-flame test method - Apparatus, confirmatory test arrangement and guidance
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 60068-2-45:1992/A1:1993 Environmental testing - Part 2: Tests - Test Xa and guidance: Immersion in cleaning solvents
    EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60068-2-69:2017 Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
    IEC 60195:2016 Method of measurement of current noise generated in fixed resistors
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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