EN 60191-1:2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
01-03-2018
20-06-2007
FOREWORD
1 Scope and object
2 Normative references
3 Terms and definitions
4 General rules for all drawings
4.1 Drawing layout
4.2 Dimensions and tolerances
4.3 Methods for locating the datum
4.4 Numbering of terminals
5 Additional rules
5.1 Rules for device and case outline drawings
5.2 Rules to specify the dimensions and positions of terminals
5.3 Rules for gauge drawings
6 Inter-conversion of inch and millimetre dimensions and rules
for rounding off
7 Rules for coding
Annex A (informative) Reference letter symbols
Annex B (normative) Standardization philosophy
Annex C (informative) Rules to specify the dimensions and
positions of terminals on a base drawing
Annex D (normative) General philosophy of flat base devices
Annex E (informative) Examples of semiconductor device drawing
Annex F (informative) Former rules for rounding off
Annex G (informative) Former rules for coding
Bibliography
Gives guidelines on the preparation of outline drawings of discrete devices. For preparation of outline drawings of surface mounted discrete devices, IEC 60191-6 should be referred to as well. The main changes from the previous edition are as follows: - requirement added for SI-dimensions for new drawings to be published; - former rules concerning inch-dimensions are given in an informative annex; - former rules for coding are given in an informative annex; - incorporation of the supplements; - updating of references; - restructuring and renumbering.
Committee |
CLC/SR 47D
|
DevelopmentNote |
Redesignated as EN IEC 60191-1. (04/2018)
|
DocumentType |
Standard
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
NEN EN IEC 60191-1 : 2007 | Identical |
NBN EN 60191-1 : 2007 | Identical |
CEI EN 60191-1 : 2008 | Identical |
OVE/ONORM EN 60191-1 : 2007 | Identical |
NF EN 60191-1 : 2013 | Identical |
DIN EN 60191-1:2007-11 | Identical |
UNE-EN 60191-1:2007 | Identical |
I.S. EN 60191-1:2007 | Identical |
PN EN 60191-1 : 2007 | Identical |
IEC 60191-1:2007 | Identical |
PNE-prEN 60191-1 | Identical |
I.S. EN 60191-6:2009 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
I.S. EN IEC 62148-1:2018 | FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - PACKAGE AND INTERFACE STANDARDS - PART 1: GENERAL AND GUIDANCE |
EN IEC 62148-1:2018 | Fibre optic active components and devices - Package and interface standards - Part 1: General and guidance |
BS EN 60191-6:2009 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
CEI EN 60191-6 : 2011 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES |
EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
ISO 5459:2011 | Geometrical product specifications (GPS) — Geometrical tolerancing — Datums and datum systems |
IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
ISO 261:1998 | ISO general purpose metric screw threads — General plan |
ISO 370:1975 | Toleranced dimensions Conversion from inches into millimetres and vice versa |
IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
ISO 263:1973 | ISO inch screw threads General plan and selection for screws, bolts and nuts Diameter range 0,06 to 6 in |
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