EN 60191-3:1999
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits
16-11-1999
1. General
2. Terminology and definitions
3. Cross-referencing of packages
4. Terminal identification - Numbering of terminals
5. Dimensions and reference letter symbols
6. Drawing layout
7. Dimensioning and tolerances
8. Inter-conversion of inch and millimetre dimensions, and
rules for rounding-off
9. Definition of families
10.Examples of drawings
11.Design procedure for dimensions of integrated circuit
packages
12.Rules for mounting integrated circuit packages into carriers
13.Bending of terminals of QUIL packages
14.Pin grid arrays
15.Rule for orientation of integrated circuit packages in
handling and shipping carriers such as stick magazines and
rails
Annex A (normative) Limits applicable for the dimensions of
integrated circuit package outlines
Annex B (informative) Example drawings showing cross-
referencing of packages, utilization of reference
letter symbols, terminal identification and index area
Annex C (normative) Terminal identification and numbering of
terminals of devices with terminals disposed in three
or more rows in each orthogonal direction
Annex D (normative) Recommended dimensions of integrated
circuit packages of form G family
Annex E (normative) General rules for the preparation of
outline drawings of packages of form G intended for
automated handling
Annex F (normative) General rules for the preparation of
outline drawings of pin grid arrays
Annex G (normative) Rule for orientation of integrated circuit
packages in handling and shipping carriers such as
stick magazines and rails
Annex H (normative) Bottom view method for terminal No.1
recognition
Annex K (normative) Gate burrs, mold flash and protrusions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives guidance on the preparation of drawings of integrated circuits outlines.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 60191-3:2000 | Identical |
| PN EN 60191-3 : 2002 | Identical |
| NF EN 60191-3 : 2000 | Identical |
| SN EN 60191-3 : 1999 | Identical |
| NBN EN 60191-3 : 2000 | Identical |
| NEN EN IEC 60191-3 : 2000 | Identical |
| I.S. EN 60191-3:2000 | Identical |
| IEC 60191-3:1999 | Identical |
| UNE-EN 60191-3:2001 | Identical |
| EN 60286-4:2013 | Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms |
| I.S. EN 60191-6-16:2007 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| BS EN 60191-6-16:2007 | Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| BS EN 60191-6:2009 | Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| BS EN 60286-4:2013 | Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms |
| I.S. EN 60286-4:2013 | PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV)) |
| CEI EN 60191-6-16 : 2008 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA |
| EN 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
| EN 60191-6-16:2007 | Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA |
| IEC 60191-1:2007 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| ISO 2692:2014 | Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR) |
| IEC 60191-2:2012 DB | Mechanical standardization of semiconductor devices - Part 2: Dimensions |
| IEC 60191-4:2013 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages |
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