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  • EN 60191-3:1999

    Current The latest, up-to-date edition.

    Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

    Available format(s): 

    Language(s): 

    Published date:  16-11-1999

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    1. General
    2. Terminology and definitions
    3. Cross-referencing of packages
    4. Terminal identification - Numbering of terminals
    5. Dimensions and reference letter symbols
    6. Drawing layout
    7. Dimensioning and tolerances
    8. Inter-conversion of inch and millimetre dimensions, and
       rules for rounding-off
    9. Definition of families
    10.Examples of drawings
    11.Design procedure for dimensions of integrated circuit
       packages
    12.Rules for mounting integrated circuit packages into carriers
    13.Bending of terminals of QUIL packages
    14.Pin grid arrays
    15.Rule for orientation of integrated circuit packages in
       handling and shipping carriers such as stick magazines and
       rails
    Annex A (normative) Limits applicable for the dimensions of
            integrated circuit package outlines
    Annex B (informative) Example drawings showing cross-
            referencing of packages, utilization of reference
            letter symbols, terminal identification and index area
    Annex C (normative) Terminal identification and numbering of
            terminals of devices with terminals disposed in three
            or more rows in each orthogonal direction
    Annex D (normative) Recommended dimensions of integrated
            circuit packages of form G family
    Annex E (normative) General rules for the preparation of
            outline drawings of packages of form G intended for
            automated handling
    Annex F (normative) General rules for the preparation of
            outline drawings of pin grid arrays
    Annex G (normative) Rule for orientation of integrated circuit
            packages in handling and shipping carriers such as
            stick magazines and rails
    Annex H (normative) Bottom view method for terminal No.1
            recognition
    Annex K (normative) Gate burrs, mold flash and protrusions
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Gives guidance on the preparation of drawings of integrated circuits outlines.

    General Product Information - (Show below) - (Hide below)

    Committee CLC/SR 47D
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

    EN 60286-4:2013 Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms
    I.S. EN 60191-6-16:2007 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    BS EN 60191-6-16:2007 Mechanical standardization of semiconductor devices Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
    BS EN 60191-6:2009 Mechanical standardization of semiconductor devices General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    BS EN 60286-4:2013 Packaging of components for automatic handling Stick magazines for electronic components encapsulated in packages of different forms
    I.S. EN 60286-4:2013 PACKAGING OF COMPONENTS FOR AUTOMATIC HANDLING - PART 4: STICK MAGAZINES FOR ELECTRONIC COMPONENTS ENCAPSULATED IN PACKAGES OF DIFFERENT FORMS (IEC 60286-4:2013 (EQV))
    CEI EN 60191-6-16 : 2008 MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-16: GLOSSARY OF SEMICONDUCTOR TESTS AND BURN-IN SOCKETS FOR BGA, LGA, FBGA AND FLGA
    EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
    EN 60191-6-16:2007 Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60191-1:2007 Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
    ISO 2692:2014 Geometrical product specifications (GPS) Geometrical tolerancing Maximum material requirement (MMR), least material requirement (LMR) and reciprocity requirement (RPR)
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 60191-4:2013 Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
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