EN 60191-6-1:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
11-12-2001
FOREWORD
1 Scope
2 Normative references
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and coplanarity
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| IEC 60191-6-1:2001 | Identical |
| NBN EN 60191 6-1 : 2002 | Identical |
| NEN EN IEC 60191-6-1 : 2002 | Identical |
| I.S. EN 60191-6-1:2002 | Identical |
| PN EN 60191-6-1 : 2003 | Identical |
| UNE-EN 60191-6-1:2002 | Identical |
| BS EN 60191-6-1:2001 | Identical |
| CEI EN 60191-6-1 : 2003 | Identical |
| DIN EN 60191-6-1:2002-08 | Identical |
| NF EN 60191-6-1 : 2002 | Identical |
| EN IEC 60191-1:2018 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| I.S. EN IEC 60191-1:2018 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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