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CENELEC
EN 60749-14:2003

EN 60749-14:2003

Current

Current

The latest, up-to-date edition.

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

Published date

17-10-2003

Publisher

European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 General
4 Test condition A - Tension
5 Test condition B - Bending stress
6 Test condition C - Lead fatigue
7 Test condition D - Lead torque
8 Test condition E - Stud torque
Annex ZA (normative) Normative references to international
         publications with their corresponding European
         publications

Provides various tests for determining the integrity between the lead/package interface and the lead itself when the lead(s) are bent due to faulty board assembly followed by rework of the part for re-assembly. Applicable to all through-hole devices and surface-mount devices requiring lead forming by the user.

Committee
CLC/TC 47X
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

CEI EN 61747-10-1 : 2014 LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL
I.S. EN 61747-10-1:2013 LIQUID CRYSTAL DISPLAY DEVICES - PART 10-1: ENVIRONMENTAL, ENDURANCE AND MECHANICAL TEST METHODS - MECHANICAL (IEC 61747-10-1:2013 (EQV))
EN 62922:2017 Organic light emitting diode (OLED) panels for general lighting - Performance Requirements
BS EN 61747-10-1:2013 Liquid crystal display devices Environmental, endurance and mechanical test methods. Mechanical
BS EN 62922:2017 Organic light emitting diode (OLED) panels for general lighting. Performance requirements
I.S. EN IEC 60749-13:2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 13: SALT ATMOSPHERE
EN IEC 60749-13:2018 Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere
EN 61747-10-1:2013 Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods – Mechanical

IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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