EN 60749-29:2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST
19-08-2011
FOREWORD
1 Scope and object
2 Terms and definitions
3 Classification and levels
4 Apparatus and material
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - Examples of special pins
that are connected to passive components
Annex B (informative) - Calculation of operating
ambient or operating case temperature for
a given operating junction temperature
Specifies the I-test and the overvoltage latch-up testing of integrated circuits. It establishes a method for determining integrated circuit latch-up characteristics and to define latch-up failure criteria.
Committee |
SR 47
|
DevelopmentNote |
Supersedes UNE EN 60749-24. (05/2014)
|
DocumentType |
Test Method
|
PublisherName |
European Committee for Standards - Electrical
|
Status |
Current
|
Supersedes |
Standards | Relationship |
IEC 60749-29:2011 | Identical |
NBN EN 60749-29 : 2011 | Identical |
NEN EN IEC 60749-29 : 2011 | Identical |
I.S. EN 60749-29:2011 | Identical |
PN EN 60749-29 : 2011 | Identical |
UNE-EN 60749-29:2004 | Identical |
BS EN 60749-29:2011 | Identical |
CEI EN 60749-29 : 2012 | Identical |
DIN EN 60749-29:2012-01 | Identical |
NF EN 60749-29 : 2012 | Identical |
UNE-EN 60749-29:2011 | Identical |
PNE-FprEN 60749-29 | Identical |
BS EN 60601-2-44:2009+A2:2016 | Identical |
BS EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans |
I.S. EN 60749-43:2017 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
EN 60749-43:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans |
CEI EN 60749-43 : 1ED 2018 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS |
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