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EN 60749-29:2011

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 29: LATCH-UP TEST

Published date

19-08-2011

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FOREWORD
1 Scope and object
2 Terms and definitions
3 Classification and levels
4 Apparatus and material
5 Procedure
6 Failure criteria
7 Summary
Annex A (informative) - Examples of special pins
        that are connected to passive components
Annex B (informative) - Calculation of operating
        ambient or operating case temperature for
        a given operating junction temperature

Specifies the I-test and the overvoltage latch-up testing of integrated circuits. It establishes a method for determining integrated circuit latch-up characteristics and to define latch-up failure criteria.

Committee
SR 47
DevelopmentNote
Supersedes UNE EN 60749-24. (05/2014)
DocumentType
Test Method
PublisherName
European Committee for Standards - Electrical
Status
Current
Supersedes

BS EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods Guidelines for IC reliability qualification plans
I.S. EN 60749-43:2017 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS
EN 60749-43:2017 Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
CEI EN 60749-43 : 1ED 2018 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 43: GUIDELINES FOR IC RELIABILITY QUALIFICATION PLANS

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