Customer Support: +353 (0)1 857 6730

Corporate Website About Us
  • Shopping Cart
    There are no items in your cart
Please enter a keyword to search
Advanced search
Home
CENELEC
EN 61189-11 : 2013

EN 61189-11 : 2013

Current

Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS

Published date

28-06-2013

Publisher

European Committee for Standards - Electrical

Sorry this product is not available in your region.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting temperatures
        of solder alloys
Annex B (informative) - Examples of test result (Method A)
Annex C (informative) - Example of test result (Method B)
Annex ZA (normative) - Normative references to international
         Publications with their corresponding
         European publications
Bibliography

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Committee
SR 91
DocumentType
Test Method
PublisherName
European Committee for Standards - Electrical
Status
Current

EN 62878-1-1:2015 Device embedded substrate - Part 1-1: Generic specification - Test methods
BS EN 62878-1-1:2015 Device embedded substrate Generic specification. Test methods

EN ISO 11357-1:2016 Plastics - Differential scanning calorimetry (DSC) - Part 1: General principles (ISO 11357-1:2016)
IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
EN ISO 9453:2014 Soft solder alloys - Chemical compositions and forms (ISO 9453:2014)
IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
ISO 9453:2014 Soft solder alloys Chemical compositions and forms
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
ISO 11357-1:2016 Plastics — Differential scanning calorimetry (DSC) — Part 1: General principles
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Get in touch with us