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CENELEC
EN 61189-11 : 2013

EN 61189-11 : 2013

Current

Current

The latest, up-to-date edition.

TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 11: MEASUREMENT OF MELTING TEMPERATURE OR MELTING TEMPERATURE RANGES OF SOLDER ALLOYS

Published date

28-06-2013

Publisher

European Committee for Standards - Electrical

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Summary of measuring methods
5 Test equipment
6 Calibration of the temperature
7 Procedure for the measuring method
Annex A (normative) - Test report on melting temperatures
        of solder alloys
Annex B (informative) - Examples of test result (Method A)
Annex C (informative) - Example of test result (Method B)
Annex ZA (normative) - Normative references to international
         Publications with their corresponding
         European publications
Bibliography

IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.

Committee
SR 91
DocumentType
Test Method
PublisherName
European Committee for Standards - Electrical
Status
Current

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