EN 61190-1-3:2007
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
04-02-2022
28-06-2007
IEC 61190-1-3:2007 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.
| Committee |
SR 91
|
| DocumentType |
Test Method
|
| ProductNote |
THIS STANDARD ALSO REFERS TO :EN 61190-1-2,EN ISO 9001,EN ISO 9453
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| SN EN 61190-1-3:2007 | Identical |
| NF EN 61190-1-3 :2008 | Identical |
| I.S. EN 61190-1-3:2007 | Identical |
| IEC 61190-1-3:2017 | Identical |
| SS-EN 61190-1-3:2007 | Identical |
| BS EN 61190-1-3 : 2007 | Identical |
| UNE-EN 61190-1-3:2007 | Identical |
| PNE-prEN 61190-1-3 | Identical |
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