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CENELEC
EN 61760-4:2015/A1:2018

EN 61760-4:2015/A1:2018

Current

Current

The latest, up-to-date edition.

SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018)

Amendment of

EN 61760-4:2015

Published date

04-05-2018

Publisher

European Committee for Standards - Electrical

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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General information
5 Assessment of moisture sensitivity
6 Test procedure
7 Requirements to packaging and labelling
8 Handling of moisture sensitive devices
9 Drying
Annex A (informative) - Moisture sensitivity of assemblies
Annex B (informative) - Mass/gain loss analysis
Annex C (informative) - Baking of devices
Annex D (normative) - Moisture sensitivity labels
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines the classification of moisture sensitive devices into moisture sensitivity levels related to soldering heat, and provisions for packaging, labelling and handling.

Committee
SR 91
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
EN ISO 62:2008 Plastics - Determination of water absorption (ISO 62:2008)
IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
EN 61340-5-1:2016/AC:2017-05 ELECTROSTATICS - PART 5-1: PROTECTION OF ELECTRONIC DEVICES FROM ELECTROSTATIC PHENOMENA - GENERAL REQUIREMENTS (IEC 61340-5-1:2016/COR1:2017)
IEC 61340-5-1:2016 Electrostatics - Part 5-1: Protection of electronic devices from electrostatic phenomena - General requirements
EN 60068-1:2014 Environmental testing - Part 1: General and guidance
MIL-PRF-131 Revision K:2005 BARRIER MATERIALS, WATERVAPORPROOF, GREASEPROOF, FLEXIBLE, HEAT-SEALABLE
IPC J STD 033C-1:2014 HANDLING, PACKING, SHIPPING AND USE OF MOISTURE, REFLOW, AND PROCESS SENSITIVE DEVICES
IEC 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
MIL-PRF-27401 Revision G:2013 Propellant Pressurizing Agent, Nitrogen
ISO 62:2008 Plastics Determination of water absorption
EN 60068-2-78:2013 Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
EN 61760-2:2007 Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
IPC J STD 075 : 0 CLASSIFICATION OF NON-IC ELECTRONIC COMPONENTS FOR ASSEMBLY PROCESSES
ASTM D 570 : 1998 : R2018 Standard Test Method for Water Absorption of Plastics
IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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