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EN 61967-2:2005

Current

Current

The latest, up-to-date edition.

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

Published date

25-10-2005

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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General
5 Test conditions
   5.1 General
   5.2 Supply voltage
   5.3 Frequency range
6 Test equipment
   6.1 General
   6.2 Shielding
   6.3 RF measuring instrument
   6.4 Preamplifier
   6.5 TEM cell
   6.6 Wideband TEM/GTEM cell
   6.7 50-Ohm termination
   6.8 System gain
7 Test set-up
   7.1 General
   7.2 Test configuration
   7.3 Test PCB
8 Test procedure
   8.1 General
   8.2 Ambient measurement
   8.3 DUT operational check
   8.4 DUT emissions measurement
9 Test report
   9.1 General
   9.2 Measurement conditions
10 IC emissions reference levels
Annex A (informative) Example calibration & set-up
                       verification sheet
Annex B (informative) TEM cell and wideband TEM cell
                       descriptions
  B.1 TEM cell
  B.2 Wideband GTEM cell
Annex C (informative) Calculation of dipole moment from
                       measured data
  C.1 General
  C.2 Dipole moment calculation
Annex D (informative) Specification of emissions data
  D.1 General
  D.2 Specification of emission levels
  D.3 Presentation of results
  D.4 Examples
Annex ZA (normative) Normative references to international
                       publications with their corresponding
                       European publications
Bibliography

This test procedure defines a method for measuring the electromagnetic radiation from an integrated circuit (IC). The IC being evaluated is mounted on an IC test printed circuit board (PCB) that is clamped to a mating port (referred to as a wall port) cut in the top or bottom of a transverse electromagnetic (TEM) or wideband gigahertz TEM (GTEM) cell. The test board is not inside the cell, as in the conventional usage, but becomes a part of the cell wall. This method is applicable to any TEM or GTEM cell modified to incorporate the wall port; however, the measured radio frequency (RF) voltage will be affected by many factors. The primary factor affecting the measured RF voltage is the septum to IC test board (cell wall) spacing. This procedure was developed using a 1 GHz TEM cell with a septum to floor spacing of 45 mm and a GTEM cell with average septum to floor spacing of 45 mm over the port area. Other cells may not produce identical spectral output but may be used for comparative measurements, subject to their frequency and sensitivity limitations. A conversion factor may allow comparisons between data measured on TEM or GTEM cells with different septum to floor spacing. The IC test board controls the geometry and orientation of the operating IC relative to the cell and eliminates any connecting leads within the cell (these are on the backside of the board, which is outside the cell). For the TEM cell, one of the 50 ports is terminated with a 50 load. The other 50 port for a TEM cell, or the single 50 port for a GTEM cell, is connected to the input of a spectrum analyser or receiver that measures the RF emissions emanating from the integrated circuit and impressed onto the septum of the cell.

Committee
CLC/TC 47X
DevelopmentNote
To be read in conjunction with EN 61967-1. (11/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Current

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IEC 60050-131:2002 International Electrotechnical Vocabulary (IEV) - Part 131: Circuit theory
CISPR 16-2-2:2010 Specification for radio disturbance and immunity measuring apparatus and methods - Part 2-2: Methods of measurement of disturbances and immunity - Measurement of disturbance power
IEC 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
CISPR 16-1-4:2010+AMD1:2012+AMD2:2017 CSV Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-4: Radio disturbance and immunity measuring apparatus - Antennas and test sites for radiated disturbance measurements
CISPR 16-1-1:2015 Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-1: Radio disturbance and immunity measuring apparatus - Measuring apparatus
CISPR 16-1-3:2004+AMD1:2016 CSV Specification for radio disturbance and immunity measuring apparatus and methods - Part 1-3: Radio disturbance and immunity measuring apparatus - Ancillary equipment - Disturbance power
CISPR 16-2-1:2014 Specification for radio disturbance and immunity measuring apparatus and methods - Part 2-1: Methods of measurement of disturbances and immunity - Conducted disturbance measurements
EN 61967-1:2002 Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
CISPR 16-2-4:2003 Specification for radio disturbance and immunity measuring apparatus and methods - Part 2-4: Methods of measurement of disturbances and immunity - Immunity measurements
IEC 61000-4-20:2010 Electromagnetic compatibility (EMC) - Part 4-20: Testing and measurement techniques - Emission and immunity testing in transverse electromagnetic (TEM) waveguides
IEC 61000-4-3:2006+AMD1:2007+AMD2:2010 CSV Electromagnetic compatibility (EMC) - Part 4-3: Testing and measurement techniques - Radiated, radio-frequency, electromagnetic field immunity test
CISPR 16-2-3:2016 Specification for radio disturbance and immunity measuring apparatus and methods - Part 2-3: Methods of measurement of disturbances and immunity - Radiated disturbance measurements

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