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EN 62047-13:2012
Current
The latest, up-to-date edition.
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Semiconductor devices - Micro-electromechanical devices - Part 13: Bend- and shear- type test methods of measuring adhesive strength for MEMS structures
06-04-2012
Foreword
1 Scope
2 Normative references
3 Terms and definitions
4 Test method
5 Test equipment
6 Test pieces
7 Test conditions
8 Test report
Annex A (informative) - Technical background
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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