I.S. EN 60068-2-54:2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
ENVIRONMENTAL TESTING - PART 2-54: TESTS - TEST TA: SOLDERABILITY TESTING OF ELECTRONIC COMPONENTS BY THE WETTING BALANCE METHOD
Hardcopy , PDF
11-04-2020
English
01-01-2006
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 General description of the test
5 Description of the test apparatus
5.1 Test system
5.2 Solder bath
6 Preconditioning
6.1 Preparation of specimens
6.2 Ageing
7 Materials
7.1 Solder
7.2 Flux
8 Procedure
8.1 Test temperature
8.2 Fluxing
8.3 Flux drying
8.4 Test
9 Presentation of results
9.1 Form of chart-recorder trace
9.2 Points of significance
9.3 Reference wetting force
9.4 Test requirements
10 Information to be given in the relevant specification
Annex A (normative) Equipment specification
Annex B (informative) Guide to the use of the wetting balance
for solderability testing
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Describes Test Ta, solder bath wetting balance method applicable for any shape of component terminations to determine the solderability.
| DevelopmentNote |
Supersedes I.S. HD 323.2.54. (09/2006) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
30
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Withdrawn
|
| SupersededBy |
| Standards | Relationship |
| UNE-EN 60068-2-54:2007 | Identical |
| IEC 60068-2-54:2006 | Identical |
| SN EN 60068-2-54 : 2006 | Identical |
| DIN EN 60068-2-54:2007-01 | Identical |
| BS EN 60068-2-54:2006 | Identical |
| EN 60068-2-54:2006 | Identical |
| NBN EN 60068-2-54 : 2007 | Identical |
| HD 323.2.20 : 200S3 | BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| IEC 60068-2-58:2015+AMD1:2017 CSV | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) |
| IEC 60068-2-20:2008 | Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 60068-2-44:1995 | Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering |
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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