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I.S. EN 60191-6-18:2010

Current

Current

The latest, up-to-date edition.

MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-18: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR BALL GRID ARRAY (BGA)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2010

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

€37.00
Excluding VAT

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Nominal package dimension
6 Symbols and drawings
7 Dimensions
8 Recommended BGA variations
Bibliography
Annex ZA (normative) Normative references to
         international publications with their
         corresponding European publications

Gives standard outline drawings, dimensions, and recommended variations for all square ball grid array packages (BGA), whose terminal pitch is 1 mm or larger.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
52
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
IEC 60191-6-18:2010 Identical
EN 60191-6-18:2010 Identical

IEC 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages
IEC 60191-6-5:2001 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
IEC 60191-6-2:2001 Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
IEC 60191-6-4:2003 Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
EN 60191-6:2009 Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

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