I.S. EN 60749-19:2003
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 19: DIE SHEAR STRENGTH
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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Foreword
1 Scope
2 Description of the test apparatus
3 Test method
4 Failure criteria
5 Requirements
6 Categories of separation
7 Summary
Determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates (for the purpose of this test method, the term 'semiconductor die' should be taken to include passive elements).
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 60749-19:2011-01 | Identical |
| NF EN 60749-19 : 2003 AMD 1 2011 | Identical |
| EN 60749-19:2003/A1:2010 | Identical |
| UNE-EN 60749-19:2003 | Identical |
| NBN EN 60749-19 : 2004 AMD 1 2010 | Identical |
| IEC 60749-19:2003+AMD1:2010 CSV | Identical |
| SN EN 60749-19 : 2003 | Identical |
| BS EN 60749-19 : 2003 | Identical |
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