I.S. EN 61189-6:2006
Current
The latest, up-to-date edition.
TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES
Hardcopy , PDF
English
01-01-2006
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
3.1 Accuracy
3.2 Precision
3.3 Resolution
3.4 Report
3.5 Student's 't' distribution
3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
8.1 Test 6C01: Determination of acid value of liquid
soldering flux - potentiometric and visual titration
methods
8.2 Test 6C02: Determination of halides in fluxes,
silver chromate method
8.3 Test 6C03: Solids content, flux
8.4 Test 6C04: Quantitative determination of halide
content in fluxes (chloride and bromide)
8.5 Test 6C05: Qualitative analysis of fluorides and
fluxes by spot test
8.6 Test 6C06: Quantitative determination of fluoride
concentration in fluxes
8.7 Test 6C07: Acid number of rosin
8.8 Test 6C08: Specific gravity
8.9 Test 6C09: Determination of the percentage of flux on/in
flux-coated and/or flux-cored solder
8.10 Test 6C10: Flux induced corrosion (copper mirror method)
9 M: Mechanical test methods
10 E: Electrical test methods
11 N: Environmental test methods
12 X: Miscellaneous test methods
12.1 Test 6X01: Determination of solder powder particle
size distribution - Screen method for types 1-4
12.2 Test 6X02: Solder powder particle size
distribution-measuring microscope method
12.3 Test 6X03: Solder powder particle size distribution -
Optical image analyzer method
12.4 Test 6X04: Solder powder particle size distribution -
Measuring laser diffraction method
12.5 Test 6X05: Determination of maximum solder powder
particle size
12.6 Test 6X06: Solder paste metal content by weight
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Presents a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
54
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 61189-6:2006 | Identical |
| NF EN 61189-6 : 2008 | Identical |
| DIN EN 61189-6:2007-03 | Identical |
| SN EN 61189-6 : 2006 | Identical |
| IEC 61189-6:2006 | Identical |
| BS EN 61189-6:2006 | Identical |
| NBN EN 61189-6 : 2007 | Identical |
| IEC 60068-1:2013 | Environmental testing - Part 1: General and guidance |
| EN 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| EN 60068-1:2014 | Environmental testing - Part 1: General and guidance |
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology |
| EN ISO 9001:2015 | Quality management systems - Requirements (ISO 9001:2015) |
| IEC 61190-1-1:2002 | Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly |
| ISO 9001:2015 | Quality management systems — Requirements |
| EN 61189-1 : 97 AMD 1 2001 | TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY |
| EN 61190-1-3:2007/A1:2010 | ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
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