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I.S. EN 61190-1-2:2014

I.S. EN 61190-1-2:2014

Current

Current

The latest, up-to-date edition.

ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-2: REQUIREMENTS FOR SOLDERING PASTES FOR HIGH-QUALITY INTERCONNECTS IN ELECTRONICS ASSEMBLY

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2014

Publisher

National Standards Authority of Ireland

Preview

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Standardized description for products
5 Test methods
6 Requirements
7 Quality assurance provisions
8 Preparation for delivery
9 Additional information - Performance and shelf life
  extension inspections
Annex A (normative) - Test report on solder paste
Annex B (informative) - Reflow condition and profile
Annex C (informative) - Typical comparison of particle
        size distributions between laser diffraction
        method and screen method
Bibliography
Annex ZA (normative) - Normative references to international
         publications with their corresponding
         European publications

Defines general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
58
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
DIN EN 61190-1-2:2014-11 Identical
EN 61190-1-2:2014 Identical
NF EN 61190-1-2 : 2014 Identical
IEC 61190-1-2:2014 Identical
BS EN 61190-1-2:2014 Identical

IEC 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
ISO 9454-2:1998 Soft soldering fluxes Classification and requirements Part 2: Performance requirements
EN ISO 9454-2:2000 Soft soldering fluxes - Classification and requirements - Part 2: Performance requirements (ISO 9454-2:1998)
IPC HDBK 005 : 0 GUIDE TO SOLDER PASTE ASSESSMENT
IEC 61189-6:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
EN 61189-5-3:2015 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
IEC 61189-5:2006 Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
EN 60194:2006 Printed board design, manufacture and assembly - Terms and definitions
IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

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