IEC 61189-5:2006
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Hardcopy , PDF
English, English - French
29-08-2006
02-04-2024
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Accuracy, precision and resolution
3.1 Accuracy
3.2 Precision
3.3 Resolution
3.4 Report
3.5 Student's t distribution
3.6 Suggested uncertainty limits
4 Catalogue of approved test methods
5 P: Preparation/conditioning test methods
5.1 Test 5P01: Test-board design guideline
5.2 Test 5P02: Standard mounting process for
CSP/BGA packages
6 V: Visual test methods
7 D: Dimensional test methods
8 C: Chemical test methods
8.1 Test 5C01: Corrosion, flux
9 M: Mechanical test methods
9.1 Test 5M01: Peel test method for test-board
land
10 E: Electrical test methods
10.1 Test 5E01: Changes of the surface insulation
resistance caused by fluxes
10.2 Test 5E02: Surface insulation resistance,
assemblies
11 N Environmental test methods
11.1 Test 5N01: Reflow solderability test for
soldering joint
11.2 Test 5N02: Resistance to reflow solderability
of test board
11.3 Test 5N03: Solderability test for test-board
land
12 X Miscellaneous test methods
12.1 Test 5X01: Liquid flux activity, wetting balance
method
12.2 Test 5X02: Paste flux viscosity - T-Bar spindle
method
12.3 Test 5X03: Spread test, liquid or extracted
solder flux, solder paste and extracted cored
wires or preforms
12.4 Test 5X04: Solder paste viscosity - T-Bar spin
spindle method (applicable to 300 Pa.s to 1,600
Pa.s)
12.5 Test 5X05: Solder paste viscosity - T-Bar spindle
method (applicable to Pa.s)
12.6 Test 5X06: Solder paste viscosity - Spiral pump
method (applicable to 300 Pa.s to 1,600 Pa.s)
12.7 Test 5X07: Solder paste viscosity - Spiral pump
method (applicable to 300 Pa.s)
12.8 Test 5X08: Solder paste - Slump test
12.9 Test 5X09: Solder paste - Solder ball test
12.10 Test 5X10: Solder paste - Tack test
12.11 Test 5X11: Solder paste - Wetting test
12.12 Test 5X12: Flux residues - Tackiness after drying
12.13 Test 5X13: Spitting of flux-cored wire solder
12.14 Test 5X14: Solder pool test
Bibliography
IEC 61189-5:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies.
| Committee |
TC 91
|
| DevelopmentNote |
To be used in conjunction with IEC 61189-1, IEC 61189-2, IEC 61189-3, IEC 61189-4, IEC 61189-6 and IEC 60068. (08/2006) A Bilingual edition has been published. (05/2008) Stability Date: 2018. (09/2017)
|
| DocumentType |
Standard
|
| Pages |
62
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Withdrawn
|
| Standards | Relationship |
| NF EN 61189-5 : 2008 | Identical |
| NEN EN IEC 61189-5 : 2006 | Identical |
| I.S. EN 61189-5:2006 | Identical |
| PN EN 61189-5 : 2010 | Identical |
| BS EN 61189-5:2006 | Identical |
| CEI EN 61189-5 : 2007 | Identical |
| EN 61189-5:2006 | Identical |
| DIN EN 61189-5:2007-05 | Identical |
| DS EN 61189-5 : 2006 | Identical |
| UNE-EN 61189-5:2006 | Identical |
This standard has been withdrawn and is no longer current. No replacement edition is available.
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.