I.S. EN 61249-4-1:2008
Current
The latest, up-to-date edition.
MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 4-1: SECTIONAL SPECIFICATION SET FOR PREPREG MATERIALS, UNCLAD (FOR THE MANUFACTURE OF MULTILAYER BOARDS) - EPOXIDE WOVEN E-GLASS PREPREG OF DEFINED FLAMMABILITY
Hardcopy , PDF
English
01-01-2008
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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
1 Scope
2 Normative references
3 Materials and construction
3.1 Reinforcement
3.2 Epoxide resin
4 Properties
4.1 Properties related to the appearance of the prepreg
4.1.1 Dewetted areas (fish eyes)
4.1.2 Broken filaments
4.1.3 Distortion
4.1.4 Creases
4.1.5 Edge conditions
4.2 Properties related to B stage prepreg
4.2.1 Resin content
4.2.2 Treated weight
4.2.3 Resin flow
4.2.4 Scaled flow thickness
4.2.5 Melting viscosity
4.2.6 Gel time
4.2.7 Volatile content
4.3 Properties of prepregs after curing to C stage
4.3.1 Electric strength
4.3.2 Flammability
4.3.3 Relative permittivity and dissipation factor
4.3.4 Cured thickness
5 Delivery form
5.1 Rolls
5.2 Sheets
5.3 Cut panels
6 Quality assurance
6.1 Quality system
6.2 Responsibility for inspection
6.3 Qualification inspection
6.4 Quality conformance inspection
6.5 Certificate of conformance
6.6 Safety data sheet
7 Packaging and marking
8 Shelf life
9 Ordering information
Annex ZA (normative) - Normative references to international
publications with their corresponding
European publications
Bibliography
Provides requirements for properties of prepreg that is mainly intended to be used as bonding sheets in connection with laminates according to IEC 61249-2-7 when manufacturing multilayer boards in line with IEC 62326-4.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 61249-4-1:2008 | Identical |
| EN 61249-4-1:2008 | Identical |
| IEC 61249-2-7:2002 | Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad |
| ISO 11014-1:1994 | Safety data sheet for chemical products Part 1: Content and order of sections |
| EN 61249-2-7:2002/corrigendum:2005 | MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD |
| IEC 62326-4:1996 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| EN 61189-3:2008 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| IEC 61189-3:2007 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) |
| ISO 14001:2015 | Environmental management systems — Requirements with guidance for use |
| IEC 60194:2015 | Printed board design, manufacture and assembly - Terms and definitions |
| EN ISO 14001:2015 | Environmental management systems - Requirements with guidance for use (ISO 14001:2015) |
| ISO 9000:2015 | Quality management systems — Fundamentals and vocabulary |
| EN 62326-4:1997 | Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification |
| IEC 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
| EN ISO 9000:2015 | Quality management systems - Fundamentals and vocabulary (ISO 9000:2015) |
| EN 61189-2:2006 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures |
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