IEC 60191-6-1:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English, Spanish, Castilian
30-10-2001
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FOREWORD
1 Scope
2 Normative reference
3 Definitions
4 References and drawings
5 Outline dimensions
6 Package height and stand-off height
7 Terminal thickness and width
8 Terminal shape
9 Tolerance of terminal center position and co-planarity
Table
Covers the requirements for the design rule of terminal shape plastic packages with gull-wing leads (e.g. QFP, SOP, SSOP, TSOP, etc.)
| DevelopmentNote |
Also numbered as BS EN 60191-6-1. (05/2002) Stability Date: 2021. (10/2012)
|
| DocumentType |
Standard
|
| Pages |
7
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN EN IEC 60191-6-1 : 2002 | Identical |
| I.S. EN 60191-6-1:2002 | Identical |
| PN EN 60191-6-1 : 2003 | Identical |
| UNE-EN 60191-6-1:2002 | Identical |
| EN 60191-6-1:2001 | Identical |
| DIN EN 60191-6-1:2002-08 | Identical |
| NF EN 60191-6-1 : 2002 | Identical |
| CEI EN 60191-6-1 : 2003 | Identical |
| EN IEC 60191-1:2018 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| 17/30352677 DC : 0 | BS IEC 61188-6-4 ED1.0 - PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 6-4: GENERIC REQUIREMENTS FOR DIMENSIONAL DRAWINGS OF SMDS FROM VIEWPOINT OF LAND-PATTERN DESIGN |
| I.S. EN IEC 60191-1:2018 | MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 1: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF DISCRETE DEVICES |
| IEC 60191-1:2018 | Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices |
| IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages |
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