IEC 60300-3-7:1999
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Dependability management - Part 3-7: Application guide - Reliability stress screening of electronic hardware
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
11-07-2007
English - French, Spanish, Castilian
31-05-1999
Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Acronyms
5 General considerations for a reliability stress
screening programme
6 General information about the reliability stress
screening process
7 Analysis of the benefits of the reliability stress
screening process
8 Characteristics of a successful reliability stress
screening programme
9 Screening types
10 Screening levels
11 Screening strength
12 Selection of screens
13 Flaws detected by a reliability stress concerning
process
14 Pre-production screening process
15 Planning, performing and eliminating a reliability
stress screening process
15.1 General
15.2 Step 1 - Identification of objectives and
goals
15.3 Step 2 - Screening process design and
application
15.4 Step 3 - Cost-benefit analysis
15.5 Step 4 - Preparation of a screening plan
15.6 Step 5 - Screening process data collection,
analysis and corrective actions
Figures
1 Levels where reliability stress screening can be
performed
2 Reliability stress screening of repairable items
3 Flow chart for control of a reliability stress
screening process
A.1 Level chosen for the RSS process
Tables
A.1 Relation between the sensitivity of flaws and stresses
Annex A (informative) RSS of repairable items produced
in lots
Annex B (informative) RSS of electronic components
Serves as an application guide to a reliability stress screening process for electronic hardware. The concept, purpose and justification of the screening process are explained. The standard is intended as a guide to be used with one of the IEC reliability stress screening standards. It gives guidance in cases where it is essential that early failures be removed from the items manufactured in order to deliver them to the customer when the problems causing the early failures are solved. It gives guidance on where the reliability stress screening should be carried out, i.e. component, subsystem or system level.
DocumentType |
Standard
|
Pages |
69
|
PublisherName |
International Electrotechnical Committee
|
Status |
Superseded
|
SupersededBy |
Standards | Relationship |
PN IEC 60300-3-7 : 2004 | Identical |
UNE 200001-3-7:2004 | Identical |
CEI 56-44 : 2000 | Identical |
BS IEC 60300-3.7 : 1999 | Identical |
NEN IEC 60300-3-7 : 1999 | Identical |
BIS IS 15474-3-7 : 2005(R2016) | Identical |
BS IEC 60300-3-7:1999 | Identical |
BIS IS 15474-1-7 : *DUPLICATE RECORD* | Identical |
CEI 56-46 : 2005 | DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES |
CEI EN 60300-3-2 : 2006 | DEPENDABILITY MANAGEMENT - PART 3-2: APPLICATION GUIDE - COLLECTION OF DEPENDABILITY DATA FROM THE FIELD |
EN 60300-3-2:2005 | Dependability management - Part 3-2: Application guide - Collection of dependability data from the field |
CEI 56-53 : 2006 | DEPENDABILITY MANAGEMENT - PART 3-10: APPLICATION GUIDE - MAINTAINABILITY |
BS IEC 60300-3.5 : 2001 | DEPENDABILITY MANAGEMENT - PART 3-5: APPLICATION GUIDE - RELIABILITY TEST CONDITIONS AND STATISTICAL TEST PRINCIPLES |
I.S. EN 60300-3-2:2005 | DEPENDABILITY MANAGEMENT - PART 3-2: APPLICATION GUIDE - COLLECTION OF DEPENDABILITY DATA FROM THE FIELD |
04/30066208 DC : DRAFT DEC 2004 | ISO 14224 - PETROLEUM AND NATURAL GAS INDUSTRIES - COLLECTION AND EXCHANGE OF RELIABILITY AND MAINTENANCE DATA FOR EQUIPMENT |
07/30144128 DC : 0 | BS EN 60300-3-15 - DEPENDABILITY MANAGEMENT - PART 3-15: GUIDANCE TO ENGINEERING OF SYSTEM DEPENDABILITY |
CEI EN 60300-3-4 : 2010 | DEPENDABILITY MANAGEMENT - PART 3-4: APPLICATION GUIDE - GUIDE TO THE SPECIFICATION OF DEPENDABILITY REQUIREMENTS |
BS EN 60300-3-2:2005 | Dependability management Application guide. Collection of dependability data from the field |
IEC 60300-3-10:2001 | Dependability management - Part 3-10: Application guide - Maintainability |
IEC 60300-3-2:2004 | Dependability management - Part 3-2: Application guide - Collection of dependability data from the field |
BS IEC 61163-2:1998 | Reliability stress screening Electronic components |
03/108624 DC : DRAFT JULY 2003 | IEC 60300-3-2 - DEPENDABILITY MANAGEMENT - PART 3-2: APPLICATION GUIDE - COLLECTION OF DEPENDABILITY DATA FROM THE FIELD |
CEI 56-36 : 2000 | RELIABILITY STRESS SCREENING - PART 2: ELECTRONIC COMPONENTS |
API 689 : 2007 | COLLECTION AND EXCHANGE OF RELIABILITY AND MAINTENANCE DATA FOR EQUIPMENT |
IEC 60300-3-5:2001 | Dependability management - Part 3-5: Application guide - Reliability test conditions and statistical test principles |
MIL-STD-883 Revision K:2016 | TEST METHOD STANDARD - MICROCIRCUITS |
MIL-STD-750 Revision F:2011 | TEST METHODS FOR SEMICONDUCTOR DEVICES |
IEC 61163-1:2006 | Reliability stress screening - Part 1: Repairable assemblies manufactured in lots |
IEC 61163-2:1998 | Reliability stress screening - Part 2: Electronic components |
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV | Semiconductor devices - Mechanical and climatic test methods |
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