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IEC 60747-4-2:2000

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

Semiconductor devices - Discrete devices - Part 4-2: Microwave diodes and transistors - Integrated-circuit microwave amplifiers - Blank detail specification

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Withdrawn date

31-12-2021

Language(s)

English

Published date

07-04-2000

€119.56
Excluding VAT

FOREWORD
INTRODUCTION
1 Marking and ordering information
   1.1 Marking
   1.2 Ordering information
2 Application-related description
3 Specification of the function
4 Limiting values (absolute maximum rating system)
5 Operating conditions (within the specified operating
   ambient or case temperature range)
   5.1 Power supply voltage
   5.2 Power supply current
   5.3 Input power (where appropriate)
   5.4 Voltage and/or current at another or other
        terminal(s) (where appropriate)
   5.5 External element(s) (where appropriate)
   5.6 Operating frequency range
   5.7 Operating temperature range
6 Electrical characteristics
   6.1 Static characteristics
   6.2 AC characteristics
7 Programming
8 Mechanical and environmental ratings, characteristics
   and data
9 Additional information
   9.1 Block diagram
   9.2 Recommendation for any associated device(s)
   9.3 Effects of temperature
   9.4 Handling precautions, or electrostatic-sensitive
        device(s)
   9.5 Internal protection
   9.6 Application data
10 Screening
11 Quality assessment procedures
   11.1 Qualification approval procedure
   11.2 Capability approval procedure
12 Structural similarity procedures
13 Test conditions and inspection requirements
   13.1 General
   13.2 Sampling requirements and formation of inspection
        lots
   13.3 Inspection tables
   13.4 Delayed delivery
14 Additional measurement method

Aims to define quality assessment procedures in such a manner that electronic components released by one participating country as conforming to the requirements of an applicable specification are equally acceptable in all other participating countries without the need for further testing.

DocumentType
Standard
Pages
17
PublisherName
International Electrotechnical Committee
Status
Withdrawn

Standards Relationship
BS IEC 60747-4.2 : 2000 Identical
NEN IEC 60747-4-2 : 2000 Identical
BS QC750116(2000) : 2000 Identical
BS IEC 60747-4-2:2000 Identical

IEC 60747-4:2007+AMD1:2017 CSV Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors
IEC 60747-10:1991 Semiconductor devices - Part 10: Generic specification for discrete devices and integrated circuits
IEC 60748-11:1990 Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits
IEC 60068-2-17:1994 Basic environmental testing procedures - Part 2-17: Tests - Test Q: Sealing
IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
IEC 60749:1996+AMD1:2000+AMD2:2001 CSV Semiconductor devices - Mechanical and climatic test methods
IEC 60748-2-10:1994 Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories

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